Electrical card having heatsink device

• US 20050088827A1
• Filed: 10/07/2004
• Published: 04/28/2005
• Est. Priority Date: 10/07/2003
• Status: Abandoned Application

• Current Assignee: Molex Incorporated
• Original Assignee: Molex Incorporated
• Inventors: Zhang, Min
• Application Number:
  US10/960,335
• Publication Number:
  US 20050088827A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 5/0269 Card housings therefor, e.g. covers, frames, PCB

Abstract

The present invention is related to an electrical card having a heatsink device, in which the electrical card includes an upper cover, a lower cover, a printed circuit board, and a heatsink device. The upper cover assembles with the lower cover so as to form a housing with a cavity therein. The printed circuit board is inserted into the cavity of the housing. The printed circuit board includes at least one heat generating element. The heatsink device has at least one heat sink apparatus mounted on the heat generating element for dissipating heat thereof in order to make the heat generating element operate in its preferred operating temperature range.

Claims

1. An electrical card, comprising:

an upper cover;

a lower cover, the lower cover assembled with the upper cover to form an housing having a cavity therein;

a printed circuit board inserted into the cavity of the housing, the printed circuit board comprising at least one heat generating element; and

a heatsink device having at least a heatsink apparatus mounted on the heat generating element.

2. The electrical card as claimed in claim 1, wherein the upper cover and the lower cover comprising opposite sidewalls respectively, a plastic frame is arranged between the upper cover and the lower cover, the plastic frame comprising brackets formed at each side thereof respectively, each of the brackets comprising grooves disposed in an upper surface and a low surface respectively so as to engage with the sidewalls of the upper cover and the lower cover.

3. The electrical card as claimed in claim 1, wherein the printed circuit board further comprising a connector disposed at a front portion thereof.

4. The electrical card as claimed in claim 1, wherein the heatsink apparatus comprises a base plate and a plurality of heatsink fins extending from the base plate in a direction away from the heat generating element.

5. The electrical card as claimed in claim 4, wherein a bottom surface of the baseplate is in contact with an outer surface of the heat generating element.

6. The electrical card as claimed in claim 1, wherein the heat sink device is mounted on a plurality of heat generating devices.

7. The electrical card as claimed in claim 1, wherein the heat sink device includes a plurality of heat sink apparatuses.

8. The electrical card as claimed in claim 1, wherein a thermal paste is placed between the heat generating element and the heat sink apparatus.

9. The electrical card as claimed in claim 5, wherein a thermal paste is placed between the heat generating element and the base plate.