Slurry compositions for chemical mechanical polishing of copper and barrier films

• US 20050090104A1
• Filed: 10/06/2004
• Published: 04/28/2005
• Est. Priority Date: 10/27/2003
• Status: Abandoned Application

• Current Assignee: Innovatium Technology, Inc.
• Original Assignee: Innovatium Technology, Inc.
• Inventors: Yang, Kai, Jeng, Wes, Tseng, Su-Man
• Application Number:
  US10/958,417
• Publication Number:
  US 20050090104A1
• Time in Patent Office: Days
• US Class Current: 438/689
• CPC Class Codes: C09G 1/02 containing abrasives or grinding agents abrasives as such C09K3/14; polishing of semi-conductors H01L
• CPC Class Codes: C23F 3/06 with acidic solutions
• CPC Class Codes: H01L 21/3212 by chemical mechanical polishing [CMP]

Abstract

CMP slurries comprising at least an abrasive, at least an organic phosphonate, at least an oxidizer, and water are disclosed. The slurries can optionally include corrosion inhibitors, surfactants, polymers, and bases. The concentrations of the ingredients in the slurries can be appropriately chosen to formulate copper CMP slurry and barrier CMP slurry. The copper CMP slurries are capable of polishing copper at high removal rate and having high selectivity to tantalum barrier. The barrier slurries deliver good planarity and have high hydrogen peroxide stability.

Claims

1. A chemical mechanical polishing slurry comprising:

(1) at least one abrasive,

(2) at least one organic phosphonate,

(3) at least one oxidizer, and

(4) water.

2. The slurry of claim 1, wherein said abrasive is selected from the metal oxide group consisting of alumina, silica, titania, ceria, and mixtures thereof.

3. The slurry of claim 2, wherein said alumina is selected from the group consisting of alpha alumina, theta alumina, delta alumina, gamma alumina, and mixture thereof.

4. The slurry of claim 2, wherein said silica is selected from the group consisting of fumed silica, colloidal silica grown from solution, and mixture thereof.

5. The slurry of claim 1, wherein said abrasive particle has an average size in the range from 20 nm to 500 nm.

6. The slurry of claim 1, wherein said abrasive is present in the amount of 0.05 to 5 weight percent for using in said copper CMP.

7. The slurry of claim 1, wherein said abrasive is silica abrasive and said silica abrasive is present in the amount of 1 to 30 weight percent for using in said barrier CMP.

8. The slurry of claim 1, wherein said organic phosphonate is selected from alkylphosphonic acid, benzenephosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotris (methylenephosphonic acid), Ethylene diamine tetra (methylene phosphonic acid), phosphonobutane-1,2,4-tricaboxylic acid, Hexamethylenediaminetetra (metylenephosphonic acid), diethylenetriamine penta (methylenephonsphonic acid), salts thereof, and mixture thereof.

9. The slurry of claim 1, wherein said organic phosphonate is present in the amount of 0.05 to 3 weight percent for using in said copper CMP.

10. The slurry of claim 1, wherein said organic phosphonate is present in the amount of 0.005 to 0.5 weight percent for using in said barrier CMP.

11. The slurry of claim 1, wherein said oxidizer is selected from group consisting of hydrogen peroxide, ammonium persulfate, potassium persulfate, ferric nitrate, potassium permaganate, potassium iodate, periodic acid, and mixture thereof.

12. The slurry of claim 1, wherein said oxidizer is hydrogen peroxide and it is present in the amount of 0.1 to 10 weight percent.

13. The slurry of claim 1, further comprising at least one additional additive, said additive is selected from the group consisting of corrosion inhibitors, surfactants, polymers, carboxylic acids, and amino acids, and bases.

14. The slurry of claim 13, wherein said corrosion inhibitors are benzotriazole, 1,2,4-triazole, tetrazole, tolytriazole, 4-carboxybenzotriazole, 5-carboxybenzotriale, mercaptobenzoxazole, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, derivative thereof, and mixture thereof.

15. The slurry of claim 13, wherein said corrosion inhibitors are present in a total amount of no more than two weight percent.

16. The slurry of claim 13, wherein said surfactants are nonionic, anionic, cationic, zwitterionic surfactants, and mixture thereof.

17. The slurry of claim 13, wherein said surfactants are present in a total amount of no more than one weight percent.

18. The slurry of claim 13, wherein said surfactants are polyoxyethylene derivatives of sorbitan esters, polyoxyethylene fatty ether, nonylphenol ethoxylates, octylphenol ethoxylates, salts of alkyl sulfate, salts of alkyl sulfonate, quaternary ammonium salts.

19. The slurry of claim 13, wherein said polymers are polyvinyl pyrrolidone, polyethylene glycol, and polyvinyl alcohol.

20. The slurry of claim 13, wherein said polymers have a molecular weight between 5000 and 1,000,000 daltons, and wherein said polymers are present in a total amount of no more than 5 weight percent.

21. The slurry of claim 13, wherein said carboxylic acids and salts thereof are acetic acid, glycolic acid, lactic acid, propionic acid, butyric acid, isobutyric acid, valeric acid, gluconic acid, benzoic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, malic acid, tartaric acid, citric acid, EDTA, maleic acid, phthalic acid, gallic acid, and salts thereof.

22. The slurry of claim 13, wherein said carboxylic acids are present in a total amount of less than three weight percent.

23. The slurry of claim 13, wherein said amino acids are glycine, alanine, isoleucine, 2-amino-n-butyric aicd, leucine, norvalin, aspartic acid, glutamic acid, glutamine, cystine, argineine, histidine, lysine, methionine, proline, serine, threonine, tyrosine, aminobenzoic acid, triptophan, tyrosine, optical isomer thereof, salts thereof, and derivative thereof.

24. The slurry of claim 13, wherein said amino acids are present in an amount of less than three weight percent.

25. The slurry of claim 13, wherein said bases are potassium hydroxide, sodium hydroxide, ammonium hydroxide, tetramethyl ammonium hydroxide, ethylenediamine and mixture thereof.

26. The slurry of claim 1, wherin the pH of said slurry is in the range from 1.5 to 9 when said slurry is used for said copper CMP.

27. The slurry of claim 1, wherein the pH of said slurry is in the range from 4 to 11 when said slurry is used for said barrier CMP.

28. The slurry of claim 1, wherein the polishing carried out using down force of about 0.3 psi to 3 psi.

29. The slurry of claim 1, wherein the components of said slurry are grouped into two or more parts and said parts are shipped in separated containers to a semiconductor wafer fabrication facility where all said parts are mixed before being used for polishing.