COOLING SYSTEM FOR AN ELECTRONIC COMPONENT
First Claim
1. A cooling system for an electronic component, comprising:
- a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors, including a plurality of thermostats that switch current to the respective thermoelectric elements off or on depending on whether the temperatures of the respective areas are above or below a predetermined set point, respectively, to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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0 Petitions
Accused Products
Abstract
A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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Citations
32 Claims
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1. A cooling system for an electronic component, comprising:
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a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors, including a plurality of thermostats that switch current to the respective thermoelectric elements off or on depending on whether the temperatures of the respective areas are above or below a predetermined set point, respectively, to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. - View Dependent Claims (2, 3, 4, 9, 10, 11, 12)
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5-8. -8. (canceled)
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13. A computer subassembly, comprising:
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an electronic component that generates heat when being operated;
a plurality of thermoelectric elements placed above a plurality of different areas of the electronic component;
a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements such that the thermoelectric elements drive heat away from the respective areas; and
a control apparatus connected to the conductors, including a plurality of thermostats that switch current to the respective thermoelectric elements off or on depending on whether the temperatures of the respective areas are above or below a predetermined set point, respectively, for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. - View Dependent Claims (14, 15)
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16. A method of cooling an electronic component, comprising:
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providing current to a plurality of thermoelectric elements placed above a plurality of different areas of an electronic component so that the thermoelectric elements pump heat away from the respective areas; and
using a plurality of thermostats that switch current to the respective thermoelectric elements off or on depending on whether the temperatures of the respective areas are above or below a predetermined set point, respectively, to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. - View Dependent Claims (17, 18, 19, 20)
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21. A cooling system for an electronic component, comprising:
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a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors, including a central power control module and a plurality of zone-power control modules that are under the control of the power control module to provide individual currents to the thermoelectric elements to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. - View Dependent Claims (22, 23, 24)
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25. A cooling system for an electronic component, comprising:
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a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component, the areas having center points that are spaced from one another in x- and y-directions;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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26. A computer subassembly, comprising:
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an electronic component that generates heat when being operated;
a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors, including a central power control module and a plurality of zone-power control modules that are under the control of the power control module to provide individual currents to the thermoelectric elements to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas. - View Dependent Claims (27, 28, 29)
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30. A computer subassembly, comprising:
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an electronic component that generates heat when being operated;
a plurality of thermoelectric elements to place above a plurality of different areas of the electronic component, the areas having center points that are spaced from one another in x- and y-directions;
a plurality of conductors connected to the thermoelectric elements to provide current to the thermoelectric elements such that the thermoelectric elements pump heat away from the respective areas; and
a control apparatus connected to the conductors to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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31. A method of cooling an electronic component, comprising:
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providing current to a plurality of thermoelectric elements placed above a plurality of different areas of an electronic component so that the thermoelectric elements pump heat away from the respective areas; and
using a central power control module and a plurality of zone-power control modules that are under the control of the power control module to provide individual currents to the thermoelectric elements, to control current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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32. A method of cooling an electronic component, comprising:
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providing current to a plurality of thermoelectric elements placed above a plurality of different areas that are spaced from one another in x- and y-directions of an electronic component so that the thermoelectric elements pump heat away from the respective areas; and
controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.
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Specification