DUAL-LAYER HEAT DISSIPATING STRUCTURE

• US 20050092465A1
• Filed: 11/05/2003
• Published: 05/05/2005
• Est. Priority Date: 11/05/2003
• Status: Active Grant

• Current Assignee: CPUMate Incorporated
• Original Assignee: CPUMate Incorporated
• Inventors: Lin, Kuo-Len, Tsui, Hui-Min
• Granted Patent: US 6,918,429 B2
• Time in Patent Office: Days
• US Class Current: 165/104.21
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2275/085 with snap connection
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A dual-layer heat dissipating structure includes a first heat sink, a second heat sink, and a heat pipe with a connecting portion and a curved portion, interconnecting the first and second heat sinks for thermal conduction. The first and second heat sinks each has a substrate and exterior fins protruding from two opposing ends thereof. Two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, and the corresponding end plates each includes an opening with respect to the slot for partially moving in the curved portion. The exterior fins of the first and second heat sinks are aligned with each other, and a snap-type connecting structures are formed on terminuses of the exterior fins. The second and first heat sinks are connected to each other by the snap-type structure, and the connection joint is reinforced by implanting soldering material.

Claims

1. A dual-layer heat dissipating structure, comprising a first heat sink and a second heat sink aligned with each other, and a heat pipe with a connecting portion and a curved portion for interconnecting the first and second heat sinks,

wherein each of the first and second heat sink includes a substrate, two end plates protruding perpendicularly from two opposing ends of the substrate, two substrates each includes at least one slot through out of two corresponding end plates of the same side for locating the connecting portion, the corresponding end plates each include an opening with respect to the slot for partially moving in the curved portion, and the end plates of the second heat sink are aligned and engaged with the end plates of the first heat sink.

2. The heat dissipating structure according to claim 1, wherein the end plates of the first and second heat sinks are engaged with each other by snapping structures formed on terminuses of the end plates.

3. The heat dissipating structure according to claim 1, further comprising a plurality of parallel fins formed between the end plates of the first and second heat sinks.

4. The heat dissipating structure according to claim 3, wherein the second heat the fins are integrally formed with the substrate.

5. The heat dissipating structure according to claim 1, wherein the second heat sink further includes a thermal conductive block having a thermal conducting coefficient larger than the second heat sink.

6. The heat dissipating structure according to claim 5, wherein the substrate of the second heat sink includes a receiving slot to embed the thermal conductive block.

7. The heat dissipating structure according to claim 6, wherein the thermal conductive block includes at least one consecutive slot connecting to the slot of the substrate of the second heat sink.

8. The heat dissipating structure according to claim 1, wherein each end plate of the first heat sink includes a recessed channel and each end plate of the second heat sink includes a protruding rib to be snapped into the recessed channel of the corresponding end plate of the first heat sink.

9. The heat dissipating structure according to claim 8, wherein the protruding rib has a circular cross section.

10. The heat dissipating structure according to claim 8, the protruding rib has a dovetail cross section.

11. The heat dissipating structure according to claim 1, wherein two corresponding end plates of the first heat sink and second heat sinks include a slit and a protrusion, respectively, to be matched together for the engagement.

12. The heat dissipating structure according to claim 11, wherein the engagement is performed by pressing the two corresponding end plates to deform the slit and the protrusion.

13. The heat dissipating structure according to claim 1, wherein the heat pipe includes two horizontal elongate members interconnected to a vertical elongate member by two respective curved members.

14. The heat dissipating structure according to claim 13, wherein one of the horizontal elongate members is inserted through one end plate of the first heat sink as a heat dissipating part, and the other horizontal elongate member is inserted through one end plate of the second heat sink as a heat receiving part.

15. The heat dissipating structure according to claim 13, wherein the horizontal and vertical elongate members are integrally formed.

16. The heat dissipating structure according to claim 1, wherein the engagement between the end plates of the first and second heat sinks is reinforced by soldering material.