Apparatus and methods for optically inspecting a sample for anomalies

• US 20050092899A1
• Filed: 11/18/2004
• Published: 05/05/2005
• Est. Priority Date: 02/26/2002
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Wolf, Ralph C., Chen, Dongsheng (Don), Greene, John D., Sullivan, Jamie M., Vo, Khiem D., Vella, Eric N., Benitez, Eva L.
• Granted Patent: US 7,012,683 B2
• Time in Patent Office: Days
• US Class Current: 250/214.00R
• CPC Class Codes: G01N 21/47 Scattering, i.e. diffuse reflection G01N21/25, G01N21/41 take precedence G01N21/55 takes precedence
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10

Abstract

Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor. The non-linear component is arranged to generate a non-linear detected signal based on the detected signal. The detector further includes a first analog-to-digital converter (ADC) coupled to the non-linear component. The first ADC is arranged to digitize the non-linear detected signal into a digitized detected signal.

Claims

1. An inspection system for detecting defects on a sample, the system comprising:

a beam generator for directing an incident beam towards a sample surface;

a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam, wherein the detector comprises;

a sensor for detecting the detected beam and generating a detected signal based on the detected beam;

a non-linear component coupled to the sensor, the non-linear component being arranged to generate a non-linear detected signal based on the detected signal; and

a first analog-to-digital converter (ADC) coupled to the non-linear component, the first ADC being arranged to digitize the non-linear detected signal into a first digitized detected signal,

wherein the detector further comprises a first feed back circuit for automatically adjusting an illumination intensity of the incident beam based on the non-linear detected signal or the detected signal; and

a data processor for determining whether there is a defect present on the sample surface based on the first digitized detected signal.

2. An inspection system as recited in claim 1, wherein the sensor is a photomultiplier tube (PMT).

3. An inspection system as recited in claim 1, wherein the sensor is selected from a group consisting of an electron multiplier tube, a micro-channel plate PMT, an avalanche photodiode, a metal channel dynode PMT, a wire mesh dynode PMT, and a PMT with explicit gate or grid electrodes and imaging arrays with programmable integration times.

4. An inspection system as recited in claim 1, wherein the non-linear component is a logarithmic amplifier.

5. An inspection system as recited in claim 4, wherein the detector further comprises a second feed back circuit for automatically adjusting a sensor gain of the sensor based on the non-linear detected signal or the detected signal.

6. An inspection system as recited in claim 5, wherein the second feed back circuit comprises:

a variable voltage supply component coupled to the non-linear component and arranged to adjust a voltage level of the sensor gain based on non-linear detected signal or the detected signal, a voltage reference signal, and one or more control signal(s); and

an amplifier coupled to the variable voltage supply and arranged to amplify the sensor gain signal prior to it being input to the sensor.

7. An inspection system as recited in claim 5, further comprising:

a second ADC for receiving the sensor gain, digitizing the sensor gain and outputting it as a digitized sensor gain signal;

a first transformation mechanism for calibrating the first digitized detected signal into a calibrated detected signal;

a second transformation mechanisms for calibrating the digitized sensor gain signal into a calibrated gain signal; and

an arithmetic logic unit (ALU) arranged to subtract the calibrated gain signal from the calibrated detected signal to form a first detected output signal,

wherein the data processor is further arranged to receive the first detected output signal and the step of determining whether there is a defect is based indirectly on the first digitized detected signal by being based directly on the first detected output signal.

8. An inspection system as recited in claim 7, wherein the first and second transformation mechanisms take the form of a look-up table embodied within a memory device.

9. An inspection system as recited in claim 6, wherein the first feedback circuit is arranged to automatically adjust the illumination intensity based indirectly on the first detected signal and based directly on the sensor gain.

10. An inspection system as recited in claim 1, the first feedback circuit comprising:

a power supply for supplying a power level to the beam generator for the incident beam; and

a variable voltage supply component for receiving the sensor gain, the non-linear detected signal or the detected signal and one or more control signal(s), the variable voltage supply component being arranged to adjust the power level supplied by the power supply so as to adjust the illumination intensity of the incident beam.

12. An inspection system as recited in claim 1, wherein the beam generator comprises a deflector for scanning the incident beam across the sample, and wherein the first feedback circuit adjusts the illumination intensity by adjusting an efficiency of the deflector.

13. An inspection system as recited in claim 1, wherein the beam generator comprises a variable attenuator within a path of the incident beam, and wherein the first feedback circuit adjusts the illumination intensity by modulating the variable attenuator.

14. An inspection system as recited in claim 7, further comprising:

a third transformation mechanism for transforming the first detected output signal into a second detected output signal, the second detected output signal being a relinearized first detected output signal when a mode signal input to the third transformation mechanism indicates a first mode and the second detected output signal equaling the first detected output signal when the mode signal indicates a second mode, and

wherein the data processor is further arranged to receive the second detected output signal and the step of determining whether there is a defect is based indirectly on the first digitized detected signal by being based directly on the second detected output signal.

15. An inspection system as recited in claim 14, wherein the second detected output signal equals a noise compensating transformation of the first detected output signal when the mode signal indicates a third mode.

16. An inspection system as recited in claim 15, wherein the transformation mechanism operates to cause a derivative of the second digitized detected signal to be equal to a normalization function which is an estimate of the inverse of the noise level or uncertainty in the measurement, and wherein the normalization function is computed by dividing an average of an envelope function by the envelope function itself, and the envelope function is calculated based on an observed repeatability of measurements of the first detected output signal.

17. An inspection system as recited in claim 7, wherein the first and second transformation mechanisms and the ALU have a higher resolution than the first and second ADCs, in order to avoid rounding errors in the transformations.

11. An inspection system as recited in claim 23, wherein the variable voltage supply component is a proportional integral differential (PID) controller.

18. A method for detecting defects on a sample, the method comprising:

directing an incident beam towards a first sample surface;

detecting a first detected beam and generating a first detected signal based on the first detected beam, wherein the first detected beam originates from the first sample surface in response to the incident beam;

generating a first non-linear detected signal based on the first detected signal;

digitizing the first non-linear detected signal into a first digitized detected signal;

analyzing the first digitized detected signal to determine whether it corresponds to a defect on the first sample surface; and

automatically adjusting an illumination intensity of the incident beam based on the first non-linear detected signal or the first detected signal.

19. A method as recited in claim 18, wherein the illumination intensity is automatically adjusted intensity based indirectly on the first detected signal and based directly on the sensor gain