Semiconductor device and manufacturing method thereof
First Claim
1. A semiconductor device, comprising:
- an IC chip having an internal circuit; and
an antenna coil formed on at least one of an active and a back surface of the IC chip and connected to the internal circuit of the IC chip for non-contact data communication.
1 Assignment
0 Petitions
Accused Products
Abstract
Exemplary embodiments of the present invention provide a semiconductor device that can be produced less costly and a manufacturing method thereof A semiconductor device according to exemplary embodiments of the invention includes an IC chip, an antenna coil formed on an active surface of the IC chip and connected to the IC chip for non-contact data communication, a connecting pad formed on the active surface of the IC chip and connected to one end of the antenna coil, one end of connecting device formed on the active surface of the IC chip and connected to the other end of the antenna coil, and a connecting pad formed on the active surface of the IC chip and connected to the other end of the connecting device. The antenna coil is connected to the internal circuit of the IC chip through the connecting pad, the connecting device, and the connecting pad.
27 Citations
13 Claims
-
1. A semiconductor device, comprising:
-
an IC chip having an internal circuit; and
an antenna coil formed on at least one of an active and a back surface of the IC chip and connected to the internal circuit of the IC chip for non-contact data communication.
-
-
2. A semiconductor device, comprising:
-
an IC chip having an active surface;
an antenna coil formed on the active surface of the IC chip and connected to the IC chip for non-contact data communication;
a first pad formed on the active surface of the IC chip and connected to one end of the antenna coil;
one end of a connecting device formed on the active surface of the IC chip and connected to a other end of the antenna coil; and
a second pad formed on the active surface of the IC chip and connected to the other end of the connecting device, the antenna coil being connected to an internal circuit of the IC chip through the first pad, the connecting device, and the second pad.
-
-
3. A semiconductor device, comprising:
-
an IC chip having an internal circuit;
an antenna coil formed on a back surface of the IC chip and connected to the IC chip for non-contact data communication;
a first through hole connected to one end of the antenna coil and formed in the IC chip;
one end of a connecting device formed on the back surface of the IC chip and connected to a other end of the antenna coil; and
a second through hole connected to the other end of the connecting device and formed in the IC chip, the antenna coil being connected to the internal circuit of the IC chip through the first through hole, the connecting device, and the second through hole.
-
-
4. A semiconductor device, comprising:
-
a flexible substrate;
an IC chip fixed on the flexible substrate; and
an antenna coil formed on at least one of an active and a back surface of the IC chip and connected to an internal circuit of the IC chip for non-contact data communication.
-
-
5. A semiconductor device, comprising:
-
a card substrate;
a recess provided at a surface of the card substrate;
an IC chip fitted into the recess;
an antenna coil formed on at least one of an active and a back surface of the IC chip and connected to the internal circuit of an IC chip for non-contact data communication; and
a protection film attached on the IC chip and the card substrate.
-
-
6. A method of producing a semiconductor device, comprising:
-
forming a semiconductor circuit on a semiconductor substrate;
forming a passivation film on an upper side of the semiconductor substrate; and
forming an antenna coil for non-contact data communication, on the passivation film, the antenna coil being connected to the semiconductor circuit. - View Dependent Claims (7, 8, 9, 10)
-
-
11. A method of producing a semiconductor device, comprising:
-
forming a semiconductor circuit in a semiconductor substrate;
forming first and second through holes in the semiconductor substrate; and
forming an antenna coil for non-contact data communication, on a back surface of the semiconductor substrate, the antenna coil having one end electrically connected to the semiconductor circuit through the first through hole and a other end electrically connected to the semiconductor circuit through the second through hole.
-
-
12. A method of producing a semiconductor device, comprising:
-
preparing an IC chip having an antenna coil for non-contact data communication formed on at least one of an active and a back surface of the IC chip; and
fixing the IC chip on a flexible substrate.
-
-
13. A method of producing a semiconductor device, comprising:
-
preparing an IC chip having an antenna coil for non-contact data communication formed on at least one of an active and a back surface of the IC chip; and
preparing a card substrate having a recess at its surface;
fitting the IC chip into the recess at the card substrate; and
attaching a protection film on the IC chip and the card substrate.
-
Specification