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Device packages with low stress assembly process

  • US 20050093134A1
  • Filed: 10/30/2003
  • Published: 05/05/2005
  • Est. Priority Date: 10/30/2003
  • Status: Abandoned Application
First Claim
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1. A packaged microelectromechanical device, comprising:

  • a microelectromechanical array device that comprises a semiconductor substrate;

    a package for the microelectromechanical array device, the package comprising a packaging substrate;

    an insert substrate that is disposed between the semiconductor substrate and the package substrate; and

    wherein the insert substrate has a CTE value that is the sane as a CTE value of the semiconductor substrate or between the value of the semiconductor substrate and a CTE value of the package substrate.

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