Printed circuit board memory module with embedded passive components
First Claim
1. A printed circuit board memory module, comprising:
- a printed circuit board having a major surface and an edge;
a plurality of memory components mounted on the major surface of the board;
a plurality of connector contacts arranged along the edge of the board;
a plurality of passive components, each of which is embedded within the circuit board beneath one of the memory components; and
a conductive trace connecting each of the passive components to at least one of the connector contacts.
1 Assignment
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Accused Products
Abstract
A memory module includes a plurality of memory components mounted on a printed circuit board, and a plurality of passive components embedded within the board directly underneath the memory components to minimize the space occupied by the passive components and the lengths of the required conductive traces. The passive components and the memory components are connected by conductor-filled vias between the contacts of the embedded components and the memory components mounted above them on the board surface. The passive components may be thick film resistors, either series damping resistors or differential damping resistors. By embedding the resistors directly beneath the memory components, there is enough space on the board to provide a set of termination resistors for each of the several memory components on the board, thereby eliminating the need for a single resistor to be shared by two or more memory components, resulting in more precise output signals.
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Citations
18 Claims
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1. A printed circuit board memory module, comprising:
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a printed circuit board having a major surface and an edge;
a plurality of memory components mounted on the major surface of the board;
a plurality of connector contacts arranged along the edge of the board;
a plurality of passive components, each of which is embedded within the circuit board beneath one of the memory components; and
a conductive trace connecting each of the passive components to at least one of the connector contacts. - View Dependent Claims (2, 3, 4)
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5. A printed circuit board memory module, comprising:
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a printed circuit board having a major surface and an edge;
a plurality of memory components mounted on the major surface of the board;
a plurality of connector contacts arranged along the edge of the board;
a pair of conductive traces connecting each of the memory components to selected ones of the connector contacts; and
a plurality of thick film resistors, each embedded within the board beneath one of the memory components, each terminating the pair of conductive traces connecting the memory component to the connector contacts. - View Dependent Claims (6, 7, 8, 9)
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10. A method of making a printed circuit board memory module, comprising:
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providing a first layer of circuit board material having a major surface and an edge;
forming a pattern of a plurality of first contact pads, a plurality of second contact pads, and a plurality of conductive traces, each extending from one of the second contact pads toward the edge;
forming a plurality of passive components, each of which bridges one of the first contact pads and one of the second contact pads;
applying a second layer of circuit board material over the first layer so as to form a circuit board in which the passive components, the first and second contact pads, and the traces are embedded, the board having a major surface and an edge;
forming a pattern of metallized memory component contact pads and a pattern of metallized connector contacts on the major surface of the board;
forming a first plurality of conductor-filled vias, each connecting one of the first contact pads with a selected one of the memory component contact pads;
forming a second plurality of conductor-filled vias, each connecting one of the second contact pads with one of the connector contacts; and
installing a memory component on the memory component contact pads. - View Dependent Claims (11, 12, 13, 14)
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15. A printed circuit board memory module, comprising:
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a printed circuit board having a major surface and an edge;
a plurality of memory components mounted on the major surface;
at least one thick film resistor embedded within the printed circuit board directly beneath each of the memory components;
a plurality of connector contacts arranged along the edge of the board; and
a plurality of conductive traces embedded below the major surface of the board, each connecting one of the resistors with one of the connector contacts. - View Dependent Claims (16, 17, 18)
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Specification