Module for bi-directional optical signal transmission

• US 20050094999A1
• Filed: 10/15/2004
• Published: 05/05/2005
• Est. Priority Date: 10/15/2003
• Status: Abandoned Application

• Current Assignee: Infineon Technologies Fiber Optics GmbH (Infineon Technologies AG)
• Original Assignee: Infineon Technologies AG
• Inventors: Weigert, Martin
• Application Number:
  US10/966,356
• Publication Number:
  US 20050094999A1
• Time in Patent Office: Days
• US Class Current: 398/33
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H04B 10/40 Transceivers

Abstract

A module for bidirectional optical signal transmission having a transmitting component that emits light of a first wavelength, a receiving component that detects light of a second wavelength, a carrier substrate that is transparent to the light of the first wavelength, on which the transmitting component is arranged, and a monitor component that detects a fraction of the light emitted by the transmitting component, wherein the receiving component is integrated in the carrier substrate, the receiving component and the transmitting component are arranged behind one another in relation to the direction of the emitted or received light, the receiving component is optically transparent to the light of the first wavelength, and light emitted by the transmitting component is transmitted through the carrier substrate and the receiving component. A second module complements such a module, in that it detects light of the first wavelength and emits light of the second wavelength.

Claims

1. A module for bidirectional optical signal transmission, the module comprising:

a transmitting component for emitting light of a first wavelength,

a receiving component for detecting light of a second wavelength,

a carrier substrate that is transparent to the light of the first wavelength, on which the transmitting component is arranged, and

a monitor component for detecting a fraction of the light of the first wavelength emitted by the transmitting component,

wherein the receiving component is integrated in the carrier substrate,

wherein the receiving component and the transmitting component are arranged behind one another in relation to a direction of the emitted or detected light,

wherein the receiving component is optically transparent to the light of the first wavelength, and

wherein the light of the first wavelength emitted by the transmitting component is transmitted through the carrier substrate and the receiving component.

2. The module as claimed in claim 1, wherein the transmitting component is mounted on the carrier substrate with its upper side facing down.

3. The module as claimed in claim 1, wherein the receiving component is integrated in the carrier substrate on the side of said substrate facing away from the transmitting component.

4. The module as claimed in claim 1, wherein the receiving component integrated in the carrier substrate forms a pn-junction integrated in the carrier substrate.

5. The module as claimed in claim 3, wherein the carrier substrate has two vias which start from the side of the carrier substrate facing the transmitting component and contact the receiving component.

6. The module as claimed in claim 1, wherein the carrier substrate is not transparent to light of the second wavelength.

7. The module as claimed in claim 1, wherein the first wavelength is greater than the second wavelength.

8. The module as claimed in claim 5, wherein the first wavelength is around 1310 nm, 1490 nm or 1550 nm, and the second wavelength is around 850 nm or 1310 nm.

9. The module as claimed in claim 1, wherein the carrier substrate consists of silicon.

10. The module as claimed in claim 1, wherein the monitor component is arranged on the side of the transmitting component facing away from the carrier substrate.

11. The module as claimed in claim 1, wherein the transmitting component is designed as a laser chip and the monitor component is designed as a monitor diode chip.

12. The module as claimed in claim 1, wherein the monitor component is integrated in the transmitting component on the side of said component facing away from the carrier substrate.

13. A module for bidirectional optical signal transmission, the module comprising:

a transmitting component for emitting light of a second wavelength,

a receiving component for detecting light of a first wavelength,

a carrier substrate that is transparent to the light of the first wavelength and the light of the second wavelength, on which the transmitting component is arranged, and

a monitor component for detecting a fraction of the light of the second wavelength emitted by the transmitting component,

wherein the receiving component and the transmitting component are arranged behind one another in relation to a direction of the emitted or detected light,

wherein the transmitting component is optically transparent to the light of the first wavelength,

wherein the light of the second wavelength emitted by the transmitting component is transmitted through the carrier substrate, and

wherein the light detected by the receiving component is transmitted through the carrier substrate and the transmitting component.

14. The module as claimed in claim 13, wherein the monitor component is integrated in the carrier substrate.

15. The module as claimed in claim 14, wherein the monitor component is integrated in the carrier substrate on the side of said substrate facing the transmitting component.

16. The module as claimed in claim 14, wherein the monitor component integrated in the carrier substrate forms a pn-junction integrated in the carrier substrate.

17. The module as claimed in claim 13, wherein the monitor component is integrated in the transmitting component.

18. The module as claimed in claim 13, wherein the transmitting component is arranged on the carrier substrate with its upper side facing down.

19. The module as claimed in claim 13, wherein the photosensitive layer of the receiving component is arranged on the side of the receiving component facing away from the transmitting component.

20. The module as claimed in claim 13, wherein the substrate of the transmitting component is not transparent to the emitted light of the second wavelength.

21. The module as claimed in claim 13, wherein the first wavelength is greater than the second wavelength.

22. The module as claimed in claim 21, wherein the first wavelength is around 1310 nm, 1490 nm or 1550 nm, and the second wavelength is around 850 nm or 1310 nm.

23. The module as claimed in claim 13, wherein the carrier substrate consists of sapphire.

24. The module as claimed in claim 13, wherein the transmitting component is designed as a laser chip and the receiving component is designed as a photodiode chip.

25. The module as claimed in claim 13, wherein a band-stop filter is additionally mounted on the transmitting component and/or the receiving component and/or the monitor component.

26. The module as claimed in claim 13, wherein the transmitting component is a vertical emitting laser.

27. A module for bidirectional optical signal transmission, the module comprising:

a carrier substrate comprising a material that is substantially transparent to light of a first wavelength and substantially opaque to light of a second wavelength, the carrier substrate having opposing first and second sides;

a transmitting component mounted on the first side of the carrier substrate and including means for emitting light of a first wavelength through the carrier substrate to the second side;

a monitor component mounted on the first side of the carrier substrate and including means for detecting light of the first wavelength; and

a receiving component mounted on the second side of the carrier substrate and including means for detecting light of the second wavelength,

wherein the receiving component is optically transparent to light of the first wavelength, and

wherein the receiving component is fabricated directly onto a surface of the carrier substrate.