Method for manufacturing a flexible panel for a flat panel display

• US 20050095945A1
• Filed: 10/30/2003
• Published: 05/05/2005
• Est. Priority Date: 08/28/2003
• Status: Active Grant

• Current Assignee: HannStar Display Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Chi-Lin, Chang, Jung-Fang, Chang, Chich-Shang
• Granted Patent: US 7,147,531 B2
• Time in Patent Office: Days
• US Class Current: 445/25
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film

Abstract

A method for manufacturing a flexible panel is disclosed, which has the following steps. First, a first substrate having a plurality of functional switches or conducting lines thereon is provided. Then, a second substrate is bonded on the functional switches or conducting lines, and the first substrate is thinned to a predetermined thickness subsequently. Afterwards, a flexible third substrate is adhered on the first substrate, wherein the first substrate is sandwiched between the second substrate and the third substrate. Finally, the second substrate is removed.

Claims

1. A method for manufacturing a flexible panel comprising:

(a) providing a first substrate having a plurality of functional switches or conducting lines thereon;

(b) bonding a second substrate on said plurality of functional switches or conducting lines;

(c) thinning said first substrate to a predetermined thickness;

(d) adhering or sealing a flexible third substrate on said first substrate, wherein said first substrate is sandwiched between said second substrate and said third substrate; and

(e) removing said second substrate.

2. The method as claimed in claim 1, further comprising a step (f) of forming a plurality of light valves, light-emitters, or conducting layers on said plurality of switches or conducting lines, and adhering or sealing a flexible fourth substrate on said plurality of light valves, light-emitters, or conducting layers after said step (e), wherein said plurality of light valves, light-emitters, or conducting layers are located between said third substrate and said fourth substrate.

3. The method as claimed in claim 1, wherein said first substrate is a glass substrate.

4. The method as claimed in claim 1, wherein said thinning method in step (c) is polishing, cutting, or etching.

5. The method as claimed in claim 1, wherein said switch is a thin film transistor.

6. The method as claimed in claim 1, wherein said first substrate thinned to have a thickness ranging from 30 to 100 μ

m.

7. The method as claimed in claim 1, wherein said flexible third substrate is made of plastic.

8. A method for manufacturing a flexible panel comprising:

(a) providing a first substrate having a plurality of functional switches or conducting lines thereon;

(b) forming a plurality of light valves, light-emitters, or conducting layers on said plurality of switches or conducting lines;

(c) adhering or sealing a flexible third substrate on said plurality of light valves, light-emitters, or conducting layers;

(d) thinning said first substrate to a predetermined thickness; and

(e) bonding a flexible fourth substrate on said thinned first substrate, wherein said first substrate, said plurality of light valves, light-emitters, or conducting layers, and said plurality of functional switches or conducting lines are located between said third substrate and said fourth substrate.

9. The method as claimed in claim 8, wherein said first substrate is a glass substrate.

10. The method as claimed in claim 8, wherein said thinning method in step (c) is polishing, cutting, or etching.

11. The method as claimed in claim 8, wherein said switch is a thin film transistor.

12. The method as claimed in claim 8, wherein said first substrate is thinned to have a thickness ranging from 30 to 100 μ

m.

13. The method as claimed in claim 8, wherein said flexible third r fourth substrate is made of plastic.

14. A method for manufacturing a flexible panel comprising:

(a) providing a first substrate having a plurality of functional switches or conducting lines thereon;

(b) bonding a second substrate on said plurality of functional switches or conducting lines;

(c) thinning said first substrate to a predetermined thickness;

(d) adhering or sealing a fifth substrate on said first substrate;

(e) removing said second substrate;

(f) forming a plurality of light valves, light-emitters, or conducting layers on said plurality of functional switches or conducting lines;

(g) removing said fifth substrate on said first substrate; and

(h) coating a flexible polymer on the surface of said plurality of light valves, light-emitters, or conducting layers and said first substrate.

15. The method as claimed in claim 14, wherein said first substrate is a glass substrate.

16. The method as claimed in claim 14, wherein said thinning method in step (c) is polishing, cutting, or etching.

17. The method as claimed in claim 14, wherein said switch is a thin film transistor.

18. The method as claimed in claim 14, wherein said first substrate is thinned to have a thickness ranging from 30 to 100 μ

m.

19. The method as claimed in claim 14, wherein the coating method in step (h) is immersion or spin coating.

20. The method as claimed in claim 14, wherein the thickness of said polymer ranges from 1 to 10 μ

m.