Wearable biomonitor with flexible thinned integrated circuit
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Accused Products
Abstract
A sensor system (30) has a sensor module (10) and a receiver module (45). The sensor module (10) functions as a wireless data collection device and has a flexible thin sheet of silicon (60, 65, 70) comprising circuitry (71, 72, 73), a flexible power source (105), and a flexible support substrate (55). The silicon, power source, and flexible support substrate are integrated as layers of the sensor module (10). The layers are placed together in the form of an adhesive bandage (10). A plurality of electrodes (80) are connected to the sensor module (10) and protrude from the flexible substrate (55) for contacting the skin of a subject body (20). The receiver module (45) includes one of an RF receiver with a wireless port for continuously receiving data (40), or a physical I/O port (87) to which the sensor module (10) can be physically connected for downloading stored data from the sensor module (10).
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Citations
40 Claims
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1-25. -25. (canceled)
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26. A method of monitoring a physiological characteristic, comprising:
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positioning a flexible sensor module on the skin of a subject body to be monitored;
collecting data through the skin for a predetermined period of time; and
analyzing the data on a device that is physically separate from the sensor module;
wherein the sensor module comprises a flexible thin sheet of silicon comprising circuitry for collecting physiological data, a flexible power source and a flexible substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33)
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34. A method of making a flexible sensor module, comprising:
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grinding an inactive side of a silicon layer on which an IC resides until the silicon becomes thin and flexible;
mounting the silicon layer on a flexible substrate of polyimide by an anisotropic conductive epoxy intermediate layer; and
covering the silicon layer and the flexible substrate with a thin flexible battery. - View Dependent Claims (35, 36)
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37. A method of making a sensor system, comprising:
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forming a sensor module by;
grinding an inactive side of a silicon layer on which an IC resides until the silicon becomes thin and flexible;
mounting the silicon layer on a flexible substrate;
covering the silicon layer and the flexible substrate with a thin flexible battery; and
providing a receiver module in the form of a data processing device for analyzing the data.
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38. (canceled)
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39. (canceled)
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40. (canceled)
Specification