Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

• US 20050098775A1
• Filed: 09/07/2004
• Published: 05/12/2005
• Est. Priority Date: 09/11/2003
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kondo, Takayuki
• Granted Patent: US 7,151,313 B2
• Time in Patent Office: Days
• US Class Current: 257/40
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/83001 involving a temporary auxiliary member not forming part of the bonding apparatus
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01L 33/0093 : Wafer bonding; Removal of the growth substrate

Abstract

Methods are provided to form wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment, with which highly reliable electrical wirings having minute wiring patterns can be formed. In wiring forming method for a tile-shaped element, which is used, when a circuit device is formed by connecting a tile-shaped element having at least an electrode and a tile configuration to a final substrate having at least an electrode, to form an electrical wiring that electrically connects the electrode of the tile-shaped element to the electrode of the final substrate, liquid material including electro conductive material is applied to at least a part of a wiring region that is a region where the electrical wiring is formed on at least one of surfaces of the final substrate and the tile-shaped element.

Claims

1. A wiring forming method for a tile-shaped element, which is used when a circuit device is formed by connecting a tile-shaped element having at least an electrode and a tile configuration to a substrate having at least an electrode, to form an electrical wiring that electrically connects the electrode of the tile-shaped element to the electrode of the substrate, the method comprising:

applying a liquid material including electroconductive material to at least a part of a wiring region that is a region where the electrical wiring is formed on at least one of surfaces of the substrate and the tile-shaped element.

2. The wiring forming method according to claim 1, further comprising:

forming the tile-shaped element into the tile configuration by cutting and separating from a first substrate, an electronic functional section formed on the first substrate that is different from the substrate.

3. The wiring forming method according to claim 1, the wiring region being a continuous region including at least a part of the electrode of the tile-shaped element and at least a part of the electrode of the substrate.

4. The wiring forming method according to claim 1, further comprising:

forming a conductive film by conducting a process to set the liquid material coated on the wiring region, and a conductive film being at least a part of the electrical wiring.

5. The wiring forming method according to claim 1, the liquid material being a liquid in which the electroconductive fine particles are dispersed in a solvent.

6. The wiring forming method according to claim 5, the solvent having volatility.

7. The wiring forming method according to claim 5, the solvent including at least one of water, alcohol, acetone, xylene, toluene, tetradecane, N-methylpyrrolidone and fluorocarbon.

8. The wiring forming method according to claim 5, the solvent including a binder material.

9. The wiring forming method according to claim 4, the setting of the liquid material including drying and heating.

10. The wiring forming method according to claim 1, further comprising:

coating the liquid material on the wiring region by dripping the liquid material in the wiring region by using an ink jet nozzle or a dispenser.

11. The wiring forming method according to claim 1, further comprising:

coating the liquid material on the wiring region by a screen printing method or a pad printing method.

12. The wiring forming method for a tile-shaped element according to claim 1, further comprising:

coating the liquid material on the wiring region after the tile-shaped element is bonded to the substrate.

21. A wiring structure characterized in being manufactured by using the wiring forming method for a tile-shaped element according to claim 1.

13. A wiring structure, comprising:

a tile-shaped element including at least an electrode;

a tile configuration bonded to a substrate having at least an electrode; and

electrical wiring that electrically connects the electrode of the tile-shaped element to an electrode of the substrate the electrical wiring being formed from binder material, and

the binder material being composed of one of epoxy, acrylic resin and polyimide.

14. The wiring structure according to claim 13, the binder material being formed from electroconductive organic polymer.

15. The wiring structure according to claim 14, the electroconductive organic polymer being one of poly (p-phenylene), polypyrrole, polythiazyl, polyacetylene, poly (p-phenylene-vinylene), polythiophene and polyaniline.

16. The wiring structure according to claim 13, the electrical wiring including electroconductive fine particles including at least one of metal and carbon

17. The wiring structure according to claim 16, the metal including at least one of silver, gold, copper, nickel, palladium, tin, and solder.

18. The wiring structure according to claim 16, the carbon being at least one of carbon powder, fullerene and carbon nanotubes.

19. The wiring structure according to claim 13, at least a surface of the electrode of the tile-shaped element including at least one of gold, alloy including gold and platinum.

20. The wiring structure according to claim 13, at least a surface of the electrode of the substrate including at least one of gold, alloy including gold, platinum, silver, copper and nickel.

22. An electronic equipment, comprising:

the wiring structure for a tile-shaped element according to claim 13.