Using backgrind wafer tape to enable wafer mounting of bumped wafers
First Claim
1. A wafer having bumps on a surface thereof for a material removal operation, comprising:
- a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming.
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Accused Products
Abstract
A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface with the backing of the adhesive tape abutting the surface. The wafer is then suctioned, after which the back surface of the wafer undergoes a grinding process to thin the wafer. Since the backing attached to the bumps on the wafer is substantially planar and sits substantially flat on the suction surface of the wafer mount, the force exerted on the wafer from the thinning process does not overcome the suction force holding the wafer on the wafer mount. Thus, the bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.
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Citations
73 Claims
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1. A wafer having bumps on a surface thereof for a material removal operation, comprising:
a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. The combination of a wafer having bumps on a surface thereof and a mount for a material removal operation comprising:
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a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming; and
a wafer mount having a suction surface temporarily connected to the backing of said tape using a suction force. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. An in-process wafer having bumps on a surface thereof for a material removal operation, comprising:
a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A wafer having bumps on a surface thereof in a process for a material removal operation, comprising:
a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A wafer having bumps on a surface thereof in a material removal operation, comprising:
a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45, 46, 47)
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48. The combination of a wafer having bumps on a surface thereof and a mount in a material removal operation comprising:
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a tape having an adhesive and a backing attached to at least a portion of said bumps of said surface having bumps thereon of said wafer, said tape conforming at least a portion of said adhesive of said tape to said bumps, said backing of said tape has a substantially planar surface after said conforming; and
a wafer mount having a suction surface temporarily connected to the backing of said tape using a suction force. - View Dependent Claims (49, 50, 51, 52, 53, 54)
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55. A wafer mount assembly and a wafer having a front surface having at least one bump thereon and a back surface, comprising:
an adhesive tape having an adhesive and a planar backing for a vacuum attachment, said adhesive tape for adhesively attaching a portion of said front surface of said wafer having said at least one bump thereon to a portion of said wafer mount assembly by said planar backing for a vacuum attachment. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64)
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65. An assembly of a bumped wafer and a wafer mount for grinding, the assembly comprising:
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a wafer having a front surface and a back surface thereof, said front surface having at least one bump thereon; and
a tape having an adhesive and a planar backing for vacuum attachment, said tape for adhesively attaching a portion of said front surface of said wafer having said at least one bump thereon. - View Dependent Claims (66, 67, 68, 69, 70, 71, 72, 73)
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Specification