Semi-conductor component testing system with a reduced number of test channels

• US 20050099201A1
• Filed: 08/29/2003
• Published: 05/12/2005
• Est. Priority Date: 09/05/2002
• Status: Active Grant

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Qimonda AG (Infineon Technologies AG)
• Inventors: Ferreira, Jesus, Kallscheuer, Jochen
• Granted Patent: US 6,977,516 B2
• Time in Patent Office: Days
• US Class Current: 324/750.15
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention involves a semi-conductor component testing system, a process for semi-conductor components, as well as an assembly, more particularly a wafer with several semi-conductor components to be tested, whereby each semi-conductor component is allocated an individual identifying label, more particularly an identification-number, in order to perform the test—done individually for each semi-conductor component—on the respective semi-conductor component.

Claims

1. A device, in particular a wafer r with several semi-conductor components to be tested,

characterized by that to each semi-conductor component an individually identifying label, more particularly an identification number is allocated in order to perform—

for each respective semi-conductor component individually—

a test on the respective semi-conductor component.

2. A device, in particular a wafer according to claim 1, in which the respective label, more particularly identification number is relayed from a test device to the respective semi-conductor component or components.

3. A device, in particular a wafer according to claim 2, in which each semi-conductor component has at least two connections —

mutually respective with the respective semi-conductor components—

, more particularly separate semi-conductor component identification connections, and the respective label is relayed from the test device to the respective semi-conductor component(s) by making available a respective signal from the test device at the first connection of a first semi-conductor component and at a second connection of the second semi-conductor component.

4. A device, in particular a wafer according to claim 3, in which the signal is emitted at the particular connection of the test device, which is connected to a first and a second contact connection, whereby the first contact connection contacts the first connection of the first semi-conductor component, and the second contact connection the second connection of the second semi-conductor component.

5. A device, in particular a wafer according to claim 2, whereby the respective label is relayed to the respective semi-conductor component(s) from the test device by means of separately provided channels for each semi-conductor component.

6. A device, in particular a wafer according to claim 5, in which the separately provided channels are used for the transfer of actual test data before or after relaying the respective label.

7. A device, in particular a wafer according to claim 6, in which an address identification is sent to the semi-conductor components to select and/or address a particular semi-conductor component, and is compared in the respective semi-conductor component with the respective label, more particularly the identification number.

8. A device, in particular a wafer according to claim 7, in which the address identification is sent via a channel, which is also used to select the respective test to be performed.

9. A device, in particular a wafer according to claim 8, in which the respective label, more particularly identification number is stored in the respective semi-conductor component by burning in respective electrical contacts, more particularly by means of fusing or e-fusing-processes.

10. A semi-conductor component testing system, with a test device, and an assembly, more particularly a wafer with several semi-conductor components, to be tested, particularly according to claim 9,

characterized by that to each semi-conductor component an individually identifying label, more particularly an identification number is allocated, in order to perform—

for each respective semi-conductor component individually—

a test on the respective-conductor component.

11. A process for testing semi-conductor components, which involves the following steps:

preparing an assembly, in particular a wafer with several semi-conductor components to be tested, particularly according to one of the claims claim 9,

characterized by that to each semi-conductor component an individual identifying label, more particularly an identification number is allocated, in order to perform—

for each respective semi-conductor component individually—

a test on the respective semi-conductor component.