Portable power amplifier

• US 20050099228A1
• Filed: 05/23/2002
• Published: 05/12/2005
• Est. Priority Date: 05/24/2001
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kitagawa, Motoyoshi, Akatsuka, Terumoto, Utsunomiya, Keisuke, Owaki, Haruki
• Granted Patent: US 7,133,705 B2
• Time in Patent Office: Days
• US Class Current: 330/66
• CPC Class Codes: H01P 1/15 by semiconductor devices
• CPC Class Codes: H03F 1/30 Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in differential amplifiers H03F3/45479
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 2200/429 Two or more amplifiers or one amplifier with filters for different frequency bands are coupled in parallel at the input or output
• CPC Class Codes: H05K 5/06 Hermetically-sealed casings specially adapted for small components H05K5/0095
• CPC Class Codes: H05K 7/1417 having securing means for mounting boards, plates or wiring boards H05K7/1461 takes precedence
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

A portable power amplifier includes portable encapsulating cases (62, 63), a printed board (61) incorporated in those encapsulating cases (62, 63), and a power amplifying device (27) mounted on this printed board (61). An antenna switch (12) and an antenna are provided near the power amplifying device (27), which is connected to those components in a pattern (65). This structure improves the heat dissipation efficiency of the portable power amplifier.

Claims

1. A portable power amplifier comprising:

a portable outer case;

a printed board disposed in said outer case;

a power amplifying device mounted to said printed board; and

a heat resisting component disposed in a vicinity of said power amplifying device and coupled to said power amplifying device via heat conductive material.

2. The portable power amplifier of claim 1, wherein said heat resisting component is an antenna radiating a high frequency radio wave.

3. The portable power amplifier of claim 2, wherein the antenna is exposed from said outer case.

4. The portable power amplifier of claim 1, wherein said heat resisting component is provided to said printed board where said power amplifying device is mounted.

5. The portable power amplifier of claim 1, wherein said heat resisting component is an antenna switch coupled between an antenna that radiates a high frequency radio wave and said power amplifying device.

6. The portable power amplifier of claim 1, wherein said heat resisting component is a chip component provided to on said printed board where said power amplifying device is mounted.

7. The portable power amplifier of claim 1, wherein said heat resisting component is a shielding case for covering an electronic component provided to said printed board where said power amplifying device is mounted.

8. The portable power amplifier of claim 7, wherein a soldering section is provided to a side face of said printed board, the shielding case covers said printed board entirely, and burr protruding toward the soldering section is provided to a side face of the shielding case.

9. The portable power amplifier of claim 8, wherein the side face of the shielding case is rougher than a top plate thereof.

10. The portable power amplifier of claim 8, wherein part of a top plate of the shielding case is cut and bent, and the part is brought into contact with a top plate of said power amplifying device.

11. The portable power amplifier of claim 8, wherein a high frequency circuit is provided in a vicinity of said power amplifying device, part of a top plate of the shielding case is cut and bent for partitioning said power amplifying device from the high frequency circuit, and a hole produced by the cutting and bending is formed on said power amplifying device side.

12. The portable power amplifier of claim 11, wherein an air intake hole is provided on a side where the high frequency circuit is disposed and on a side face of the shielding case at a vicinity of the soldering section, and an air outlet hole is provided on a top plate of the shielding case at a vicinity of said power amplifying device.

13. The portable power amplifier of claim 11, wherein the high frequency circuit is a voltage controlling oscillator.

14. The portable power amplifier of claim 1, wherein said heat resisting component is the outer case to which heat conductive material is provided.

15. The portable power amplifier of claim 6, wherein a chip capacitor is inserted between one of a power control terminal and a power supply terminal of said power amplifying device, and grounding.

16. The portable power amplifier of claim 6, wherein a dc cut-off chip capacitor is coupled in series to one of an input terminal and an output terminal of said power amplifying device.

17. The portable power amplifier of claim 6 further comprising a filter coupled to an output terminal of said power amplifying device, wherein the filter includes a plurality of chip components, at least one of the chip components is inserted between the output terminal and grounding, and the grounding is prepared on a closer side to a metallic shielding case.

18. The portable power amplifier of claim 17, wherein the filter has a chip inductor coupled to the output terminal of said power amplifying device, and the chip inductor is reflow-soldered to said printed board.

19. The portable power amplifier of claim 17 further comprising an inductor coupled to the output terminal of said power amplifying device, wherein the inductor is a pattern inductor.

20. The portable power amplifier of claim 1, wherein said heat resisting component is copper foil.

21. The portable power amplifier of claim 20, wherein the copper foil has a rough surface.

22. The portable power amplifier of claim 20 further comprising an impedance matching circuit coupled to one of an input terminal and an output terminal of said power amplifying device, wherein the matching circuit includes a pattern inductance.

23. The portable power amplifier of claim 20 further comprising an impedance matching circuit coupled to one of an input terminal and an output terminal of said power amplifying device, wherein the matching circuit includes a plurality of chip components that are reflow-soldered.

24. The portable power amplifier of claim 23, wherein at least one of the chip components is grounded, and the grounding is provided close to a metallic shielding case.

25. The portable power amplifier of claim 6, the chip component is a dc cut-off capacitor.

26. The portable power amplifier of claim 6, wherein the chip component is a bypass capacitor for preventing noises of a power supply.

27. The portable power amplifier of claim 7, wherein a space is provided between an end of said printed board and an end of the shielding case disposed above the end of said printed board.

28. The portable power amplifier of claim 25, wherein said printed board is placed such that a space is provided above and below said power amplifying device respectively.

29. The portable power amplifier of claim 1 further comprising an audio input device and an audio output device that is disposed above the audio input device, wherein said printed board is provided between the audio input device and the audio output device.