Vertical impedance sensor arrangement and method for producing a vertical impedance sensor arrangement
First Claim
1. A vertical impedance sensor arrangement, comprising:
- a substrate;
a first electrically conductive structure having a first uncovered surface and being arranged in and/or on the substrate;
a spacer arranged above the substrate and/or at least partially on the first electrically conductive structure, said spacer being formed separately from the substrate, and the thickness of said spacer being defined by means of a deposition method;
a second electrically conductive structure having a second uncovered surface and being arranged on the spacer; and
capture molecules, which are immobilized on the first and on the second uncovered surface, are set up such that particles to be detected hybridize with said capture molecules.
3 Assignments
0 Petitions
Accused Products
Abstract
Vertical impedance sensor arrangement including a substrate, a first electrically conductive structure having a first uncovered surface and being arranged in and/or on the substrate, a spacer arranged above the substrate and/or at least partially on the first electrically conductive structure, a second electrically conductive structure having a second uncovered surface and being arranged on the spacer, and capture molecules, which are immobilized on the first and on the second uncovered surface, are set up such that particles to be detected hybridize with the capture molecules. The spacer is formed separately from the substrate, and the thickness of the spacer is defined by means of a deposition method.
58 Citations
16 Claims
-
1. A vertical impedance sensor arrangement, comprising:
-
a substrate;
a first electrically conductive structure having a first uncovered surface and being arranged in and/or on the substrate;
a spacer arranged above the substrate and/or at least partially on the first electrically conductive structure, said spacer being formed separately from the substrate, and the thickness of said spacer being defined by means of a deposition method;
a second electrically conductive structure having a second uncovered surface and being arranged on the spacer; and
capture molecules, which are immobilized on the first and on the second uncovered surface, are set up such that particles to be detected hybridize with said capture molecules. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
-
15. A method for producing a vertical impedance sensor arrangement, comprising the steps of:
-
forming a first electrically conductive structure, which has a first uncovered surface, in and/or on a substrate;
forming a spacer above the substrate and/or at least partially on the first electrically conductive structure, said spacer being formed separately from the substrate, and the thickness of said spacer being defined by means of a deposition method;
forming a second electrically conductive structure, which has a second uncovered surface, on the spacer; and
immobilizing capture molecules on the first and second uncovered surfaces, said capture molecules being set up such that particles to be detected hybridize with said capture molecules. - View Dependent Claims (16)
-
Specification