Self-shadowing MEM structures
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Accused Products
Abstract
Self-shadowed microelectromechanical structures such as self-shadowed bond pads, fuses and compliant members and a method of fabricating self-shadowing microelectromechanical structures that anticipate and accommodate blanket metalization process steps are disclosed. In one embodiment, a self-shadowed bond pad (10) configured for shadowing an exposed end (44A) of a shielded interconnect line (44) connected to the bond pad (10) from undesired metalization during a metalization fabrication process step includes electrically connected overlaying first, second and third bond pad areas (42, 72, 92) patterned from respective first, second and third layers (40, 70, 90) of material deposited on a substrate (20). The exposed end (44A) of the interconnect line (44) abuts an edge of the first bond pad area (42). The third bond pad area (92) includes at least one tab portion (94) extending laterally from an edge of the third bond pad area (92) to shadow an area on the substrate (20) including the exposed end (44A) of the interconnect line (44) abutting the edge of the first bond pad area (42).
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Citations
39 Claims
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1-23. -23. (canceled)
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24. A self-shadowed bond pad configured for shadowing the exposed end of a shielded interconnect line connected to said bond pad from undesired metalization during a metalization fabrication process step, said bond pad comprising:
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a substrate;
a first bond pad area formed in a first layer of electrically conductive material deposited on said substrate, wherein the exposed end of the interconnect line abuts an edge of said first bond pad area;
at least one second layer support wall formed in a second layer of electrically conductive material deposited on said substrate, said second layer support wall extending upward from said first bond pad area;
a second bond pad area formed in said second layer of electrically conductive material, said second bond pad area being supported in an overlaying relationship above said first bond pad area by said second layer support wall;
at least one third layer support wall formed in a third layer of electrically conductive material, said third layer support wall extending upward from said second bond pad area;
a third bond pad area formed in said third layer of electrically conductive material, said third bond pad area being supported in an overlaying relationship above said second bond pad area by said third layer support wall, said third bond pad area including at least one tab portion extending laterally from an edge of said third bond pad area to shadow an area on said substrate including the exposed end of the interconnect line abutting the edge of said first bond pad area. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39-42. -42. (canceled)
Specification