Use of paraffin-containing powders as phase-change materials (pcm) in polymer composites in cooling devices

• US 20050104029A1
• Filed: 12/13/2002
• Published: 05/19/2005
• Est. Priority Date: 01/07/2002
• Status: Abandoned Application

• Current Assignee: Merck Patent GmbH (Merck & Co., Inc.)
• Original Assignee: Merck Patent GmbH (Merck & Co., Inc.)
• Inventors: Neuschuetz, Mark
• Application Number:
  US10/500,818
• Publication Number:
  US 20050104029A1
• Time in Patent Office: Days
• US Class Current: 252/70
• CPC Class Codes: C09K 5/063 Materials absorbing or liberating heat during crystallisation; Heat storage materials
• CPC Class Codes: F28D 20/02 using latent heat
• CPC Class Codes: H01L 23/4275 by melting or evaporation of solids
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02E 60/14 Thermal energy storage

Abstract

The invention relates to polymer composites comprising phase-change materials and to their use in devices for cooling, in particular, electrical and electronic components.

Claims

1. Polymer composites suitable as matrix for phase-change materials (PCMs) for the storage of heat, comprising polymers, a silica matrix in which the PCMs are embedded, and optionally additives and/or auxiliaries.

2. Polymer composites according to claim 1, characterised in that, as PCMs, paraffins are embedded in a silica matrix.

3. Polymer composites according to claim 1, characterised in that the PCMs are embedded in hydrophobicised silica.

4. Polymer composites according to claim 1, characterised in that the PCMs in a silica matrix are incorporated into polymers selected from the group consisting of silicones, polyurethanes and polyesters.

5. Polymer composites according to claim 1, characterised in that auxiliaries are added to the polymers.

6. Polymer according to claim 5, characterised in that the auxiliary is a substance having good thermal conductivity, in particular a metal powder, metal granules or graphite.

7. Device for cooling heat-generating components, essentially consisting of a heat-dissipating unit and a heat-absorbing unit, which contains at least one polymer composite according to claim 1.

8. Device according to claim 7, characterised in that the heat-dissipating unit has structures, in particular cooling fins, which increase the surface area.

9. Device according to claim 7, characterised in that the heat-dissipating unit has a fan for additional cooling.

10. Computer containing polymer composites according to claim 1.

11. Use of polymer composites according to claim 1 in computers and electronic data-processing systems.

12. Use of polymer composites according to claim 1 in power circuits and power switching circuits for mobile communications, transmitter circuits for mobile telephones and fixed transmitters, control circuits for electromechanical actuating elements in industrial electronics and in motor vehicles, high-frequency circuits for satellite communications and radar applications, single-board computers and for actuating elements and control units for domestic appliances and industrial electronics.