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Method of fabricating a semiconductor device

  • US 20050104068A1
  • Filed: 12/17/2004
  • Published: 05/19/2005
  • Est. Priority Date: 11/17/1998
  • Status: Active Grant
First Claim
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1. An electronic equipment having a display device comprising:

  • a substrate;

    a first thin film transistor formed over the substrate, said first thin film transistor comprising;

    a first semiconductor island including at least a first channel formation region, a second channel formation region, lightly doped regions and source and drain regions;

    a first gate insulating film formed over the first semiconductor island;

    a first gate electrode formed over the first channel formation region with the first gate insulating film interposed therebetween; and

    a second gate electrode formed over the second channel formation region with the first gate insulating film interposed therebetween;

    a driving circuit including at least one second thin film transistor formed over the substrate, said second thin film transistor comprising;

    a second semiconductor island including at least a third channel formation region;

    a second gate insulating film formed over the second semiconductor island;

    a third gate electrode formed over the third channel formation region with the second gate insulating film interposed therebetween;

    an interlayer insulating film covering the first, second and third gate electrodes and said first and second semiconductor islands; and

    a pixel electrode formed over the interlayer insulating film and electrically connected to one of the source and drain regions of the first semiconductor island, wherein each of the first, second and third gate electrodes has tapered edges with a taper angle in a range of 3°

    to 60°

    .

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