COMPACT, HIGH Q INDUCTOR FOR INTEGRATED CIRCUIT
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Abstract
An inductor for an integrated circuit made of a plurality of stacked, electrically coupled, metal layers. Each metal layer includes an inductor formed of a spiral pattern, which except for the top and bottom inductors, are electrically coupled to the spiral inductor formed on the metal layer above and below with an electrical path or via formed between each metal layer. The top and bottom inductors are electrically coupled to the inductor directly below and above, respectively.
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Citations
12 Claims
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1-5. -5. (canceled)
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6. A stacked inductor comprising:
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a semiconductor substrate;
a plurality of conductive layers formed on the substrate, the plurality of conductive layers being arranged from a first conductive layer closest to the, substrate to a last conductive layer furthest from the substrate; and
a plurality of conductive spirals corresponding to the plurality of conductive layers such that a first spiral is formed in the corresponding first conductive layer, a second spiral is formed in the corresponding second conductive layer, and so on, wherein each spiral includes at least two concentric turns coiled from a first end at an outer radius of the spiral to a second end at an inner radius of the spiral;
wherein the first end of the first spiral forms a first port for the inductor, a second end of the first spiral couples through a first via to the second end of the second spiral, the first end of the second spiral couples though a second via to the first end of the third spiral, and so on such that the second end of the next-to-last spiral couples through a last via to the second end of the last spiral, the first end of the last spiral forming a second port for the inductor. - View Dependent Claims (7, 8, 9, 10, 11)
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12-16. -16. (canceled)
Specification