Bimorph MEMS devices
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Abstract
A micro-electromechanical dimensioned bimorph structure includes a first element layer structure, and a second element layer structure. The element layer structures are provided in various combinations, including piezoelectric/piezoelectric, antiferroelectric/antiferroelectric or antiferroelectric/piezoelectric. The layer thickness of the element structure is less than 100 μm. A bonding layer bonds the first element structure directly to the second element structure and the bonding layer thickness is less than 10 μm. The bimorph structure can be made in various forms including a cantilever or a diaphragm. Microfluidic devices using the bimorph structures may also be constructed.
36 Citations
31 Claims
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1. (canceled)
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2. (canceled)
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3. (canceled)
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4. (canceled)
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5. (canceled)
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6. (canceled)
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7. (canceled)
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8. (canceled)
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9. (canceled)
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10. (canceled)
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11. (canceled)
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12. A microelectro-mechanical dimensioned bimorph structure comprising:
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a first MEMS sized morphable element structure;
a second MEMS sized morphable element structure; and
a bonding layer bonding the first element structure directly to the second element structure, the bonding layer being less than 10 μ
m in thickness. - View Dependent Claims (13, 14, 15, 16, 17, 18, 22, 23, 24, 25, 26)
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19. (canceled)
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20. (canceled)
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21. (canceled)
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27. An antiferroelectric/antiferroelectric bimorph structure comprising:
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a first antiferroelectric structure;
a second antiferroelectric structure;
a bonding layer bonding the first antiferroelectric element structure directly to the second antiferroelectric element structure;
first electrical connections for connecting the first antiferroelectric structure to the driving circuit;
second electrical connection for connecting the second antiferroelectric structure to the driving circuit, independent from the first antiferroelectric structure, wherein the first and second antiferroelectric elements are independently controlled.
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28. A microfluidic ejector comprising:
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a nozzle plate;
a fluidic cavity body bonded to the nozzle plate; and
a MEMS sized diaphragm bimorph actuator structure bonded to the cavity body, wherein the diaphragm bimorph actuator structure is configured to push fluid.
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- 29. The microfluidic ejector according to claim 29, wherein the bimorph actuator structure is comprised of a piezoelectric/piezoelectric layer structure, with each piezoelectric layer thickness less than 100 μ
Specification