Surface processes in fabrications of microstructures
First Claim
1. A method for modifying a surface of a microelectromechanical device, the method comprising:
- loading the microelectromechanical device into a chamber;
preparing a cleaning agent comprising ozone gas and a co-agent that comprises oxygen-containing molecules; and
introducing the prepared cleaning agent into the chamber, for cleaning the surface of the microelectromechanical device in the chamber.
4 Assignments
0 Petitions
Accused Products
Abstract
A method for altering surfaces of a microstructure is disclosed. The modification comprises cleaning the surfaces using an ozone-containing cleaning agent. The modification may also comprise coating the surfaces of the microstructure using a vapor phase coating agent that reacts chemically with the surface. The modification may also comprise coating the surfaces of the microstructure using a lubricant that interacts physically with the surface. The modification can be performed after removal of sacrificial materials of the microstructure during the fabrication process. In particular, the modification method is applicable during the packaging stage for the microstructure.
35 Citations
83 Claims
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1. A method for modifying a surface of a microelectromechanical device, the method comprising:
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loading the microelectromechanical device into a chamber;
preparing a cleaning agent comprising ozone gas and a co-agent that comprises oxygen-containing molecules; and
introducing the prepared cleaning agent into the chamber, for cleaning the surface of the microelectromechanical device in the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A method for modifying a surface of a microelectromechanical device that is assembled within an assembly, the method comprising:
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loading the assembly into a chamber;
preparing a gaseous modification agent; and
introducing the gaseous modification agent into the chamber such that the cleaning agent is delivered through a micro-opening of the assembly to the surface of the microelectromechanical device for modifying the surfaces of the microelectromechanical device, wherein the micro-opening has a characteristic dimension around 10 micrometers or less. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. A method for modifying a surface of a microelectromechanical device, the method comprising:
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assembling the microelectromechanical device into an assembly that comprises at least two substrates, one of which is opaque to ultra-violet light;
loading the assembly into a chamber;
preparing a gaseous modification agent; and
introducing the gaseous modification agent into the chamber for modifying the surface of the microelectromechanical device. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. A method for modifying a surface of a microelectromechanical device in an assembly, the method comprising:
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loading the assembly into a chamber; and
introducing a gaseous modification agent into the chamber such that the agent is delivered through an opening of the assembly to the surface of the microelectromechanical device, further comprising;
a) introducing a first component of the agent into the chamber at a first pressure; and
b) introducing a second component of the agent into the chamber at a second pressure that is higher than the first pressure. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64)
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65. A method for processing a surface of a microelectromechanical device during a packaging process for the microelectromechanical device, the method comprising:
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assembling the microelectromechanical device into an assembly;
attaching the assembly to a packaging substrate;
loading the package substrate attached with the assembly into a chamber;
preparing a cleaning agent comprising ozone gas and an oxygen containing co-agent;
introducing the prepared cleaning agent into the chamber for cleaning the surface of the microelectromechanical device in the chamber; and
sealing the microelectromechanical device between the package substrate and a cover lid by bonding the cover lid to the substrate. - View Dependent Claims (66, 67, 68, 69, 70)
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71. A method for processing a surface of a microelectromechanical device during a packaging process for the microelectromechanical device, the method comprising:
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assembling the microelectromechanical device into an assembly;
attaching the assembly to a packaging substrate;
loading the package substrate attached with the assembly into a chamber;
preparing a gaseous modification agent; and
introducing the gaseous modification agent into the chamber such that the cleaning agent is delivered through an micro-opening of the assembly to the surface of the microelectromechanical device for modifying the surfaces of the microelectromechanical device, wherein the micro-opening has a characteristic dimension around 10 micrometers or less; and
sealing the microelectromechanical device between the package substrate and a cover lid by bonding the cover lid to the substrate. - View Dependent Claims (72, 73, 74, 75, 76)
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77. A method for cleaning a surface of a microelectromechanical device, the method comprising:
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loading the microelectromechanical device into a chamber; and
cleaning the surfaces of the microelectromechanical device in the chamber using a cleaning agent that comprises ozone gas. - View Dependent Claims (78, 79, 80)
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81. A method for processing a surface of a microelectromechanical device during a packaging process for the microelectromechanical device, the method comprising:
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assembling the microelectromechanical device into an assembly that comprises at least two substrates, one of which is opaque to ultra-violet light;
attaching the assembly to a packaging substrate;
loading the package substrate attached with the assembly into a chamber;
preparing a gaseous modification agent; and
introducing the gaseous modification agent into the chamber for modifying the surface of the microelectromechanical device.
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82. A system for modifying a microelectromechanical device, the system comprising:
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a cleaning agent chamber containing ozone gas;
a co-agent source containing an oxygen containing co-agent;
a coating source containing a coating agent; and
a chamber that is connected to the cleaning source, the co-agent source and the coating source. - View Dependent Claims (83)
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Specification