×

Method of manufacturing a semiconductor device

  • US 20050106874A1
  • Filed: 09/08/2004
  • Published: 05/19/2005
  • Est. Priority Date: 09/12/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a semiconductor device, comprising:

  • depositing a SiO2 film on a substrate having a wiring pattern thereon;

    coating a Spin on glass film on the SiO2 film; and

    polishing the Spin on glass film using slurry containing cerium oxide and cationic surfactant with a chemical-mechanical polishing process.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×