Method for controlled application of reactive vapors to produce thin films and coatings
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Abstract
A vapor phase deposition method and apparatus for the application of thin layers and coatings on substrates. The method and apparatus are useful in the fabrication of electronic devices, micro-electromechanical systems (MEMS), Bio-MEMS devices, micro and nano imprinting lithography, and microfluidic devices. The apparatus used to carry out the method provides for the addition of a precise amount of each of the reactants to be consumed in a single reaction step of the coating formation process. The apparatus provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the coating formation process. The precise addition of each of the reactants in vapor form is metered into a predetermined set volume at a specified temperature to a specified pressure, to provide a highly accurate amount of reactant.
55 Citations
31 Claims
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1-10. -10. (canceled)
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11. A method for vapor-phase deposition of coatings, where at least one precursor used for formation of said coating exhibits a vapor pressure below about 150 Torr at a temperature of 25°
- C., the method comprising;
a) providing a processing chamber in which said coating is vapor deposited;
b) providing at least one precursor exhibiting a vapor pressure below about 150 Torr at a temperature of 25°
C.;
c) transferring vapor of said precursor to a precursor vapor reservoir in which said precursor vapor accumulates;
d) accumulating a nominal amount of said precursor vapor required for said vapor phase coating deposition; and
e) adding said nominal amount of said precursor vapor to said processing chamber in which said coating is being deposited. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
- C., the method comprising;
Specification