Solid-state imaging device and method for manufacturing the same

• US 20050109926A1
• Filed: 10/21/2004
• Published: 05/26/2005
• Est. Priority Date: 10/23/2003
• Status: Active Grant

• Current Assignee: Panasonic Semiconductor Solutions Co., Ltd. (Winbond Electronics Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Minamio, Masanori, Shimizu, Katsutoshi, Yamauchi, Kouichi
• Granted Patent: US 7,202,469 B2
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.

Claims

1. A solid-state imaging device comprising:

a wiring board composed of an insulating resin;

frame-shaped ribs arranged on the wiring board;

a transparent plate arranged on an upper surface of the ribs;

a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside;

an imaging element fixed on the wiring board within the internal space; and

connecting members that connect electrodes of the imaging element and the wiring members,

wherein the ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive.

2. The solid-state imaging device according to claim 1,

wherein an end face of the wiring board, an external lateral face of the ribs and an end face of the transparent plate form a flush surface that is perpendicular to the wiring board.

3. The solid-state imaging device according to claim 1,

wherein an internal lateral face of the ribs is inclined such that a width of the ribs becomes smaller on the wiring board side.

4. The solid-state imaging device according to claim 3,

wherein an inclination angle of the ribs is in a range of 2 to 12°

with respect to a direction perpendicular to a surface of the wiring board.

5. A method for manufacturing a solid-state imaging device comprising a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members that connect electrodes of the imaging element and the wiring members, the method comprising:

resin molding rib forming members for forming a plurality of the ribs constituting a plurality of the solid-state imaging devices onto a face of the transparent plate having a region corresponding to the plurality of the solid-state imaging devices;

using a wiring board member in which a plurality of the wiring members are arranged in regions corresponding to a plurality of wiring boards, and fixing imaging elements inside the regions corresponding to the respective wiring boards and connecting the electrodes of the imaging elements and the wiring members by the connecting members;

fixing the rib forming members to the surface of the wiring board member using an adhesive, with the rib forming members facing the wiring board member and the transparent plate opposing the wiring board member such that the imaging elements are arranged within frames formed by the rib forming members; and

separating the solid-state imaging devices into pieces by cutting the wiring board member, the rib forming members and the transparent plate.

6. The method for manufacturing a solid-state imaging device according to claim 5,

wherein the rib forming members are formed into a lattice shape, and when cutting the wiring board member and the transparent plate, the rib forming members are cut in such a direction that a width of the rib forming members is divided into two.

7. The method for manufacturing a solid-state imaging device according to claim 6,

wherein, when resin molding the rib forming members on the face of the transparent plate, a lateral face of the rib forming members is formed with an inclination, such that the width of the rib forming members becomes smaller with increased distance from the face of the transparent plate.