Solid-state imaging device and method for manufacturing the same
First Claim
1. A solid-state imaging device comprising:
- a wiring board composed of an insulating resin;
frame-shaped ribs arranged on the wiring board;
a transparent plate arranged on an upper surface of the ribs;
a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside;
an imaging element fixed on the wiring board within the internal space; and
connecting members that connect electrodes of the imaging element and the wiring members, wherein the ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive.
3 Assignments
0 Petitions
Accused Products
Abstract
A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.
9 Citations
7 Claims
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1. A solid-state imaging device comprising:
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a wiring board composed of an insulating resin;
frame-shaped ribs arranged on the wiring board;
a transparent plate arranged on an upper surface of the ribs;
a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside;
an imaging element fixed on the wiring board within the internal space; and
connecting members that connect electrodes of the imaging element and the wiring members, wherein the ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. - View Dependent Claims (2, 3, 4)
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5. A method for manufacturing a solid-state imaging device comprising a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members that connect electrodes of the imaging element and the wiring members, the method comprising:
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resin molding rib forming members for forming a plurality of the ribs constituting a plurality of the solid-state imaging devices onto a face of the transparent plate having a region corresponding to the plurality of the solid-state imaging devices;
using a wiring board member in which a plurality of the wiring members are arranged in regions corresponding to a plurality of wiring boards, and fixing imaging elements inside the regions corresponding to the respective wiring boards and connecting the electrodes of the imaging elements and the wiring members by the connecting members;
fixing the rib forming members to the surface of the wiring board member using an adhesive, with the rib forming members facing the wiring board member and the transparent plate opposing the wiring board member such that the imaging elements are arranged within frames formed by the rib forming members; and
separating the solid-state imaging devices into pieces by cutting the wiring board member, the rib forming members and the transparent plate. - View Dependent Claims (6, 7)
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Specification