LED package

• US 20050110036A1
• Filed: 04/29/2004
• Published: 05/26/2005
• Est. Priority Date: 11/20/2003
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Choi, Seung Hwan, Moon, Seoung Ju, Park, Joung Uk
• Granted Patent: US 7,164,159 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Disclosed is an LED package, which comprises a substrate, internal electrodes provided in an even (2n) number and formed on an upper surface of the substrate, external electrodes provided in the even (2n) number, formed on at least a part of surfaces of the substrate other than the upper surface of the substrate, and electrically connected to the corresponding internal electrodes, and LEDs provided in the even (2n) number, located on the upper surface of the substrate, and provided with an anode and a cathode, wherein the anodes and cathodes of the LEDs are electrically connected to the internal electrodes such that the anode of each of the LEDs is connected to the anode of a neighboring one of the LEDs and the cathode of each of the LEDs is connected to the cathode of another neighboring one of the LEDs.

Claims

1. An LED package comprising:

a substrate;

internal electrodes provided in an even (2n) number and formed on an upper surface of the substrate;

external electrodes provided in the even (2n) number, formed on at least a part of surfaces of the substrate other than the upper surface of the substrate, and electrically connected to the corresponding internal electrodes; and

LEDs provided in the even (2n) number, located on the upper surface of the substrate, and provided with an anode and a cathode,

wherein the anodes and cathodes of the LEDs are electrically connected to the internal electrodes such that the anode of each of the LEDs is connected to the anode of a neighboring one of the LEDs and the cathode of each of the LEDs is connected to the cathode of another neighboring one of the LEDs.

2. The LED package as set forth in claim 1, further comprising a dam, having a designated height, formed at an edge of the upper surface of the substrate so that the LEDs provided in the even (2n) number are surrounded by the dam, and sealed with epoxy.

3. The LED package as set forth in claim 2,

wherein the dam is provided with a tilted inner surface.

4. The LED package as set forth in claim 2,

wherein the dam is made of polyphthalamide.

5. The LED package as set forth in claim 2,

wherein the epoxy includes a non-YAG fluorescent substance containing Tb, Al, O, and Ce.

6. The LED package as set forth in claim 1,

wherein the anodes and cathodes of the LEDs are electrically connected to the internal electrodes by a wire-bonding method.

7. The LED package as set forth in claim 1,

wherein the LEDs are LED flip chips.