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Surface processing method for a chip device and a chip device formed by he method

  • US 20050110051A1
  • Filed: 11/17/2004
  • Published: 05/26/2005
  • Est. Priority Date: 11/20/2003
  • Status: Abandoned Application
First Claim
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1. A surface processing method for a chip device, comprising the steps of:

  • (a) providing a chip body having at least one exposed surface;

    (b) applying a polymeric monomer solution having a plurality of monomers to the at least one exposed surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and

    (c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one exposed surface, wherein the solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering external or internal interference.

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