Surface processing method for a chip device and a chip device formed by he method
First Claim
1. A surface processing method for a chip device, comprising the steps of:
- (a) providing a chip body having at least one exposed surface;
(b) applying a polymeric monomer solution having a plurality of monomers to the at least one exposed surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and
(c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one exposed surface, wherein the solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering external or internal interference.
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Abstract
A surface processing method for a chip device includes the steps of: (a) providing a chip body having at least one exposed surface; (b) applying a polymeric monomer solution having a plurality of monomers to the at least one surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and (c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one surface. The solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering any external or internal interference.
9 Citations
13 Claims
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1. A surface processing method for a chip device, comprising the steps of:
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(a) providing a chip body having at least one exposed surface;
(b) applying a polymeric monomer solution having a plurality of monomers to the at least one exposed surface of the chip body, wherein each of the monomers has a soft fragment fluorocarbon (FC) polymer end and a polar silane group; and
(c) curing the polymeric monomer solution to remove solvents out under proper environment settings, and to polymerize the monomers into a solid polymer layer on the at least one exposed surface, wherein the solid polymer layer thus has an exposed surface having a soft fragment FC polymer structure for protecting the chip body from encountering external or internal interference. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A chip device, comprising:
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a chip body having at least one surface; and
a solid polymer layer, which is formed on the at least one surface using a polymeric monomer solution having a plurality of monomers, wherein the polymeric monomer solution has a fluorocarbon (FC) polymer end and a polar silane group, the FC polymer end is exposed out to protect the chip body from encountering external or internal interference, and the polar silane group strongly bonds the solid polymer layer to the at least one surface. - View Dependent Claims (9, 10, 11, 12, 13)
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Specification