Method for forming a multi-layer seed layer for improved Cu ECP
First Claim
1. A method for forming a copper damascene comprising the steps of:
- providing a substrate comprising a semiconductor substrate;
forming an insulator layer on the substrate;
forming a damascene opening through a thickness portion of the insulator layer;
forming a diffusion barrier layer to line the damascene opening;
forming a first seed layer overlying the diffusion barrier;
plasma treating the first seed layer in-situ with a first treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH3;
forming a second seed layer overlying the first seed layer;
forming a copper layer overlying the second seed layer according to an electro-chemical plating (ECP) process to fill the damascene opening; and
, planarizing the copper layer to form a metal interconnect structure.
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Abstract
A copper filled damascene structure and method for forming the same the method including providing a substrate comprising a semiconductor substrate; forming an insulator layer on the substrate; forming a damascene opening through a thickness portion of the insulator layer; forming a diffusion barrier layer to line the damascene opening; forming a first seed layer overlying the diffusion barrier; plasma treating the first seed layer in-situ with a first treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH3; forming a second seed layer overlying the first seed layer; forming a copper layer overlying the second seed layer according to an electro-chemical plating (ECP) process to fill the damascene opening; and, planarizing the copper layer to form a metal interconnect structure.
78 Citations
41 Claims
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1. A method for forming a copper damascene comprising the steps of:
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providing a substrate comprising a semiconductor substrate;
forming an insulator layer on the substrate;
forming a damascene opening through a thickness portion of the insulator layer;
forming a diffusion barrier layer to line the damascene opening;
forming a first seed layer overlying the diffusion barrier;
plasma treating the first seed layer in-situ with a first treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH3;
forming a second seed layer overlying the first seed layer;
forming a copper layer overlying the second seed layer according to an electro-chemical plating (ECP) process to fill the damascene opening; and
,planarizing the copper layer to form a metal interconnect structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for forming a copper damascene comprising the steps of:
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providing a substrate comprising a semiconductor substrate and metal interconnect structures;
forming a low-K dielectric insulator layer on the substrate;
forming a damascene opening through a thickness portion of the low-K dielectric insulator layer;
forming a diffusion barrier layer to line the damascene opening;
forming a first seed layer over the diffusion barrier layer;
plasma treating the first seed layer with a first treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH3;
forming a second seed layer over the first seed layer;
plasma treating the second seed layer with a second treatment plasma comprising plasma source gases selected from the group consisting of argon, nitrogen, hydrogen, and NH3;
forming a copper layer over the second seed layer according to an electro-chemical plating (ECP) process to fill the damascene opening; and
,planarizing the copper layer to form a metal interconnect structure. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A copper filled damascene comprising:
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a substrate comprising a semiconductor substrate and metal interconnect structures;
an insulator layer on the substrate;
a damascene opening extending through a thickness portion of the insulator layer;
a diffusion barrier layer to lining the damascene opening;
a first seed layer overlying the diffusion barrier comprising a substantially oxide-free plasma treated surface;
a second seed layer overlying the first seed layer; and
,an ECP copper layer overlying the second seed layer filling the damascene opening. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification