Light emitting diode package structure

• US 20050110401A1
• Filed: 11/25/2003
• Published: 05/26/2005
• Est. Priority Date: 11/25/2003
• Status: Abandoned Application

• Current Assignee: Topson Optoelectronics Semi-Conductor Co., Ltd.
• Original Assignee: Topson Optoelectronics Semi-Conductor Co., Ltd.
• Inventors: Lin, Jung Kan
• Application Number:
  US10/720,526
• Publication Number:
  US 20050110401A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

A LED package structure includes a substrate, a light emitting diode die located on the substrate, and a phosphoric medium layer located on the substrate and covered the light emitting diode die. The phosphoric medium layer has a package mold precipitated a phosphor sediment layer on bottom and the phosphor sediment layer tightly covers the light emitting diode die to reduce the light-color leakage rate of the LED.

Claims

1. A light emitting diode (LED) package structure, comprising:

a substrate;

a light emitting diode die located on the substrate; and

a phosphoric medium layer located on the substrate and covered the light emitting diode die, wherein the phosphoric medium layer comprises a package mold precipitated a phosphor sediment layer on bottom and the phosphor sediment layer tightly covers the light emitting diode die.

2. The LED package structure of claim 1 wherein the package mold is an epoxy resin.

3. The LED package structure of claim 1 wherein the phosphor sediment layer is composed of phosphor powders.

4. The LED package structure of claim 1 wherein the phosphoric medium layer is formed on the substrate by a casting mold.

5. The LED package structure of claim 1 emits white light.

6. The LED package structure of claim 1 wherein the phosphoric medium layer further covered by an outer package mold.

7. The LED package structure of claim 6 wherein the outer package mold is formed on the substrate by a casting mold.

8. The LED package structure of claim 6 wherein the outer package mold is an epoxy resin.

9. The LED package structure of claim 1 wherein the substrate is a printed circuit board.