Apparatus and methods for constructing array plates

• US 20050112757A1
• Filed: 12/17/2004
• Published: 05/26/2005
• Est. Priority Date: 12/19/2001
• Status: Abandoned Application

• Current Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Original Assignee: Affymetrix, Inc. (Thermo Fisher Scientific Incorporated)
• Inventors: Spence, Eric Jason, Yamamoto, Melvin
• Application Number:
  US11/016,660
• Publication Number:
  US 20050112757A1
• Time in Patent Office: Days
• US Class Current: 506/9
• CPC Class Codes: B01J 19/0046 Sequential or parallel reactions, e.g. for the synthesis of polypeptides or polynucleotides; Apparatus and devices for combinatorial chemistry or for making molecular arrays synthesis methods per se C40B50/00
• CPC Class Codes: B01J 2219/00315 Microtiter plates
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00364 Pipettes
• CPC Class Codes: B01J 2219/00432 Photolithographic masks
• CPC Class Codes: B01J 2219/00497 Features relating to the solid phase supports
• CPC Class Codes: B01J 2219/005 Beads
• CPC Class Codes: B01J 2219/00504 Pins
• CPC Class Codes: B01J 2219/00527 Sheets
• CPC Class Codes: B01J 2219/00574 radioactive
• CPC Class Codes: B01J 2219/00576 fluorophore
• CPC Class Codes: B01J 2219/00578 electrophoric
• CPC Class Codes: B01J 2219/00585 Parallel processes
• CPC Class Codes: B01J 2219/00596 Solid-phase processes
• CPC Class Codes: B01J 2219/00605 the compounds being directly bound or immobilised to solid supports
• CPC Class Codes: B01J 2219/0061 The surface being organic
• CPC Class Codes: B01J 2219/00612 the surface being inorganic
• CPC Class Codes: B01J 2219/00626 Covalent
• CPC Class Codes: B01J 2219/00637 by coating it with another layer
• CPC Class Codes: B01J 2219/00641 the porous medium being continuous, e.g. porous oxide substrates
• CPC Class Codes: B01J 2219/00662 : Two-dimensional arrays within two-dimensional arrays
• CPC Class Codes: B01J 2219/00675 : In-situ synthesis on the substrate
• CPC Class Codes: B01J 2219/00689 : using computers
• CPC Class Codes: B01J 2219/00691 : using robots
• CPC Class Codes: B01J 2219/00704 : integrated with the reactor apparatus
• CPC Class Codes: B01J 2219/00711 : Light-directed synthesis
• CPC Class Codes: B01J 2219/00722 : Nucleotides
• CPC Class Codes: B01J 2219/00725 : Peptides
• CPC Class Codes: B01J 2219/00729 : Peptide nucleic acids [PNA]
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0636 : Integrated biosensor, microarrays
• CPC Class Codes: B01L 2300/0829 : Multi-well plates; Microtitration plates
• CPC Class Codes: B01L 3/5085 : for multiple samples, e.g. microtitration plates
• CPC Class Codes: B29C 65/00 : Joining or sealing of preformed parts , e.g. welding of plastics materials; Apparatus therefor general aspects of processes or apparatus for joining preformed parts B29C66/00; using porous material formed by internal pressure generated therein for joining preformed parts B29C44/1228, B29C44/326
• CPC Class Codes: B29C 65/02 : by heating, with or without pressure
• CPC Class Codes: B29C 65/18 : using heated tools
• CPC Class Codes: B29C 65/48 : using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 65/4835 : Heat curing adhesives
• CPC Class Codes: B29C 65/4845 : Radiation curing adhesives, e.g. UV light curing adhesives
• CPC Class Codes: B29C 65/56 : using mechanical means or mechanical connections, e.g. form-fits
• CPC Class Codes: B29C 65/562 : using extra joining elements, i.e. which are not integral with the parts to be joined using plastic snap elements B29C65/58; using plastic rivets B29C65/601
• CPC Class Codes: B29C 65/568 : using a swaging operation, i.e. totally deforming the edge or the rim of a first part to be joined to clamp a second part to be joined
• CPC Class Codes: B29C 65/58 : Snap connection
• CPC Class Codes: B29C 66/112 : Single lapped joints
• CPC Class Codes: B29C 66/114 : Single butt joints
• CPC Class Codes: B29C 66/234 : said joint lines being in the form of tessellations
• CPC Class Codes: B29C 66/30223 : said melt initiators being rib-like
• CPC Class Codes: B29C 66/324 : Avoiding burr formation
• CPC Class Codes: B29C 66/53461 : joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
• CPC Class Codes: B29C 66/55 : sealing elements being incorporated into the joints, e.g. gaskets B29C66/52296 takes precedence
• CPC Class Codes: B29C 66/61 : Joining from or joining on the inside for making tubes by bending sheets and joining from the inside B29C53/387
• CPC Class Codes: B29C 66/71 : characterised by the composition of the plastics material of the parts to be joined welding bar compositions B29C65/125
• CPC Class Codes: B29K 2023/12 : PP, i.e. polypropylene
• CPC Class Codes: B29K 2025/06 : PS, i.e. polystyrene
• CPC Class Codes: B29K 2027/16 : PVDF, i.e. polyvinylidene fluoride
• CPC Class Codes: B29K 2027/18 : PTFE, i.e. polytetrafluorethene , e.g. ePTFE, i.e. expanded polytetrafluorethene
• CPC Class Codes: B29K 2033/08 : Polymers of acrylic acid esters, e.g. PMA, i.e. polymethylacrylate
• CPC Class Codes: B29K 2033/12 : Polymers of methacrylic acid esters, e.g. PMMA, i.e. polymethylmethacrylate
• CPC Class Codes: B29K 2055/02 : ABS polymers, i.e. acrylonitrile-butadiene-styrene polymers
• CPC Class Codes: B29K 2069/00 : Use of PC, i.e. polycarbonates or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2083/00 : Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
• CPC Class Codes: B29K 2995/0069 : non-permeable
• CPC Class Codes: B29L 2031/756 : Microarticles, nanoarticles
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor

Abstract

In one embodiment, a method is provided for making an array plate for high throughput assays.

Claims

1. A method for making an array plate comprising the steps of

a) providing a body comprising a plurality of cavities wherein a cavity is open at two ends and has a recess at one of the ends;

b) providing a wafer comprising a plurality of arrays on its surface;

c) applying adhesive in the recess of the body;

d) aligning the body over the wafer so that the cavities are placed on the wafer wherein the cavities surround and enclose an array; and

e) fixedly attaching the wafer to the body to define wells.

2-16. -16. (canceled)

17. A fluid containment structure comprising a form-in-place gasket disposed on a substrate.

18. The fluid containment structure of claim 17, wherein the form-in-place gasket is between about 10 micrometers and about 250 micrometers thick.

19. The fluid containment structure of claim 17, wherein the form-in-place gasket is between about 250 micrometers and about 1.5 millimeters thick.

20. The fluid containment structure of claim 17, wherein the form-in-place gasket is between about 100 micrometers and about 3 millimeters wide.

21. The fluid containment structure of claim 17, wherein the form-in-place gasket is adapted to be placed against a cover to form a fluid-tight seal that may be broken and reformed by removing and replacing the cover.

22. The fluid containment structure of claim 17, further comprising an analysis component in operable relation to the substrate.

23. The fluid containment structure of claim 17, wherein the substrate defines a depression in the substrate, the depression defining a well.

24. A method of forming a fluid containment structure comprising depositing a gasket material onto a substrate, curing the gasket material to provide a form-in-place gasket, wherein the form-in-place gasket defines an interior area of the substrate, and the interior area and the form-in-place gasket together define the fluid containment structure.

25. The method of claim 24, wherein the gasket material is self-leveling.

26. The method of claim 24, wherein the gasket material is non-slumping.

27. The method of claim 24, wherein the form-in-place gasket is of uniform thickness.

28. The method of claim 24, wherein the form-in-place gasket is between about 10 micrometers and about 250 micrometers thick.

29. The method of claim 24, wherein the form-in-place gasket is between about 250 micrometers and about 1500 micrometers thick.

30. The method of claim 24, wherein the form-in-place gasket between about 100 micrometers and about 1000 micrometers wide.

31. The method of claim 24, wherein the form-in-place gasket is between about 100 micrometers and about 3000 micrometers wide.

32. The method of claim 24, wherein the gasket material is a self-leveling material that has a viscosity of between about 15,000 to about 50,000 centipoise.

33. The method of claim 24, wherein the form-in-place gasket is adapted to be placed against a cover to form a fluid-tight seal that may be broken and re-formed by removing and replacing the cover.

34. The method of claim 24, wherein curing comprises a process selected from the group comprising contacting the gasket material with moisture in the air, heating the gasket material, shining light on the gasket material, and contacting the gasket material with a catalyst.

35. The method of claim 24, wherein the substrate further comprises an analysis component.

36. The assay chamber according to claim 24, wherein the substrate defines a depression in the substrate, the depression defining a well.

37. An apparatus comprising a plurality of assay chambers, the apparatus comprising, in order, a substrate, a form-in-place gasket, and a cover, wherein the form-in-place gasket, the substrate, and the cover together substantially define a plurality of assay chambers.

38. The apparatus of claim 37, wherein the assay chambers are spaced at uniform intervals.

39. The apparatus of claim 38;

wherein the uniform interval is selected from the group consisting of about 4.5 mm, about 9 mm, and about 2.25 mm.

40. The apparatus of claim 39, wherein the assay chambers are adapted to being placed in fluid communication with an external fluid dispensing system that handles multiple fluids in parallel.

41. The apparatus of claim 37, wherein the form-in-place gasket, the substrate, and the cover together further define a plurality of inlets and outlets, each assay chamber in fluid communication with an inlet and an outlet.

42. The apparatus of claim 41, wherein the inlets are adapted to being fluidically coupled to an external fluid dispensing system that handles multiple fluids in parallel.

43. The apparatus of claim 42, wherein the inlets are spaced at uniform intervals.

44. The apparatus of claim 38;

wherein the uniform interval is selected from the group consisting of about 4.5 mm, about 9 mm, and about 2.25 mm.

45. The apparatus of claim 37, further comprising a plurality of assay components, each analysis component being in operable association with one or more of the assay chambers.

46. The apparatus of claim 45, wherein the analysis components are arrays, and wherein each assay chamber is in operable association with one or more of the arrays.

47. The apparatus of claim 37, wherein the form-in-place gasket is between about 10 micrometers and about 250 micrometers thick.

48. The apparatus of claim 37, wherein the form-in-place gasket is between about 250 micrometers and about 1.5 millimeters thick.

49. The apparatus of claim 37, wherein the form-in-place gasket is between about 100 micrometers and about 3 millimeters wide.

50. The apparatus of claim 37, wherein a fluid tight seal formed by the form-in-place gasket, the substrate, and the cover may be broken and re-formed by removing and replacing the cover.

51. A method of performing an array hybridization experiment comprising:

Contacting a target solution with an array disposed in an assay chamber, wherein the assay chamber is substantially defined by a substrate, a cover, and a form-in-place gasket, the form-in-place gasket positioned between the substrate and the cover, wherein the contacting is done under conditions and for a period of time sufficient to allow specific binding interactions between the target solution and the array, and Interrogating the array.

52. The method of claim 51, wherein the substrate and the cover are substantially planar.

53. The method of claim 51, wherein the substrate defines a depression in the substrate, the depression defining a well.

54. The method of claim 51, wherein the cover defines a depression in the cover, the depression defining a well.

55. The method of claim 51, further comprising an array substrate disposed within the assay chamber, the array substrate having a surface, wherein the array is disposed on the surface of the array substrate.

56. The method of claim 51, wherein at least one of the substrate or the cover has an interior surface, wherein the molecular array is disposed on the interior surface.

57. The method of claim 51, wherein the chamber further comprises an inlet port.

58. The method of claim 51, wherein the chamber further comprises an outlet port.

59. The method of claim 51, wherein the chamber has no port.

60. The method of claim 51, wherein contacting comprises depositing the target solution into a well defined at least in part by one of the substrate or the cover and placing the other one of the substrate or cover over the well with the form-in-place gasket positioned between the substrate and the cover such that a fluid tight seal is formed by the form-in-place gasket positioned between the substrate and the cover.

61. The method of claim 51, wherein contacting comprises introducing the target solution into the chamber via an inlet port in fluid communication with the chamber.

62. The method of claim 51, wherein the assay chamber is adapted to opening at the form-in-place gasket to allow access to the array.

63. The method of claim 51, wherein the assay chamber is adapted for interrogation of the array without displacing the cover from the substrate.

64. The method of claim 51, wherein the form-in-place gasket has a thickness of between about 10 micrometers and about 1.5 millimeters.

65. The method of claim 51, wherein the form-in-place gasket has a width of between about 100 micrometers and about 3 millimeters.

66. The method of claim 51, further comprising, before interrogating the array, submerging the array chamber in a wash buffer and, while the array chamber is submerged, displacing the cover from the substrate to allow wash buffer to contact the array.

67. A method of forming an assay chamber comprising depositing a gasket material onto a substrate, curing the gasket material to provide a form-in-place gasket, and positioning a cover adjacent the substrate to provide the assay chamber, the assay chamber having the form-in-place gasket disposed between the cover and the substrate.

68. The method of claim 67, wherein the gasket material is self-leveling.

69. The method of claim 67, wherein the gasket material is non-slumping.

70. The method of claim 67, wherein the form-in-place gasket is of uniform thickness.

71. The method of claim 67, wherein the form-in-place gasket is between about 10 micrometers and about 250 micrometers thick.

72. The method of claim 67, wherein the form-in-place gasket is between about 250 micrometers and about 1500 micrometers thick.

73. The method of claim 67, wherein the form-in-place gasket between about 100 micrometers and about 1000 micrometers wide.

74. The method of claim 67, wherein the form-in-place gasket between about 100 micrometers and about 3000 micrometers wide.

75. The method of claim 67, wherein curing is done before positioning.

76. The method of claim 67, wherein the gasket material is contacted with the cover before curing.

77. The method of claim 67, wherein the gasket material is a self-leveling silicone material that has a viscosity of between about 15,000 to about 50,000 centipoise.

78. The method of claim 67, wherein the cover may be placed against the form-in-place gasket to form a fluid-tight seal that may be broken and reformed by removing and replacing the cover.

79. The method of claim 67, wherein the form-in-place gasket forms a non-releasable seal between the cover and the substrate.

80. The method of claim 67, wherein curing comprises contacting the gasket material with moisture in the air.

81. The method of claim 67, wherein curing comprises heating the gasket material.

82. The method of claim 67, wherein curing comprises shining light on the gasket material.

83. The method of claim 67, wherein curing comprises contacting the gasket material with a catalyst.

84. The method of claim 67, wherein one of the cover or substrate further comprises an analysis component.

85. An assay chamber comprising a substrate, a cover, and a form-in-place gasket disposed between the substrate and the cover.

86. The assay chamber according to claim 85, wherein the form-in-place gasket has a thickness of between about 10 micrometers and about 1.5 millimeters.

87. The assay chamber according to claim 85, wherein the form-in-place gasket has a width of between about 100 micrometers and about 3 millimeters.

88. The assay chamber according to claim 85, wherein the assay chamber further comprises an analysis component.

89. The assay chamber according to claim 85, wherein the substrate defines a depression in the substrate, the depression defining a well.

90. The assay chamber according to claim 85, wherein the cover defines a depression in the cover, the depression defining a well.