Optoelectronic semiconductor component

• US 20050116238A1
• Filed: 12/02/2004
• Published: 06/02/2005
• Est. Priority Date: 09/29/1995
• Status: Active Grant

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Schellhorn, Franz, Arndt, Karlheinz, Waitl, Gunter
• Granted Patent: US 7,199,454 B2
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Claims

1-9. -9. (canceled)

10. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a chip carrier part;

a base body surrounding at least a partial region of the chip carrier part;

a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part, and

a radiation permeable encapsulation surrounding the semiconductor chip;

said chip carrier part projecting from said base body and being utilized for at least one of an electrical connection and a thermal connection.

11. The semiconductor component of claim 10 further comprising a trough structure defining recess around said semiconductor chip and providing a reflective inner surface.

12. The semiconductor component of claim 11 wherein said trough structure is part of said chip carrier part.

13. The semiconductor component of claim 10 wherein said base body is formed of radiation impermeable material.