Method of manufacturing a semiconductor device
4 Assignments
0 Petitions
Accused Products
Abstract
The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN).
14 Citations
14 Claims
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1-9. -9. (canceled)
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10. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) providing a lead frame, the lead frame including a chip mounting portion, a plurality of leads arranged around the chip mounting portion, and suspending leads for supporting the chip mounting portion;
(b) mounting a semiconductor chip over the chip mounting portion;
(c) connecting electrodes formed over the semiconductor chip and the leads corresponding thereto with each other through wires;
(d) disposing the lead frame over a sealing sheet disposed over a die surface of a resin molding die, thereafter clamping the resin molding die in such a manner that the plural leads of the lead frame come into close contact with the sealing sheet, then sealing the semiconductor chip and the wires with a sealing resin to form a sealing body in such a manner that the sealing resin is allowed to lap over back surfaces of the chip mounting portion and the suspending leads and portions of the back surfaces of the suspending leads corresponding to outer edge portions of the sealing body are covered with the sealing body; and
(e) separating the leads and the suspending leads from the lead frame. - View Dependent Claims (11)
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12. A method of manufacturing a semiconductor device, comprising the steps of:
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(a) disposing a lead frame over a sealing sheet disposed over a die surface of a resin molding die, the lead frame including a chip mounting portion, suspending leads, and a plurality of leads;
(b) after the step (a), clamping the resin molding die in such a manner that the plural leads of the lead frame come into close contact with the sealing sheet;
(c) after the step (b), sealing a semiconductor chip mounted over the chip mounting portion with a sealing resin to form a sealing body in such a manner that the sealing resin is allowed to lap over back surfaces of the chip mounting portion and the suspending leads and portions of the back surfaces of the suspending leads corresponding to outer edge portions of the sealing body are covered with the sealing body;
(d) advancing a cutting punch from the back surface side of the sealing body to cut the plural leads;
(e) after the step (d), turning the sealing body upside down, and thereafter marking a surface of the sealing body from the surface side; and
(f) advancing the cutting punch from the surface side of the sealing body to cut the suspending leads. - View Dependent Claims (13)
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14-15. -15. (canceled)
Specification