Microelectronic element having trace formed after bond layer

• US 20050116344A1
• Filed: 10/29/2004
• Published: 06/02/2005
• Est. Priority Date: 10/29/2003
• Status: Abandoned Application

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Humpston, Giles
• Application Number:
  US10/977,515
• Publication Number:
  US 20050116344A1
• Time in Patent Office: Days
• US Class Current: 257/750
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H01L 2224/02 Bonding areas; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/02331 Multilayer structure
• CPC Class Codes: H01L 2224/02351 comprising interlocking features
• CPC Class Codes: H01L 2224/0239 Material of the redistribution layers
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05023 the whole internal layer protruding from the surface
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/0508 being stacked
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05611 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05639 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/92144 : the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/02 : Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An article is provided which includes a structure overlying a face of an element. The structure includes a first metal layer and a wettable metal layer overlying the first metal layer. A conductive trace overlies and contacts at least one of the first metal layer and the wettable metal layer, the trace having a composition different from at least one of the first metal layer and the wettable metal layer.

Claims

1. An article, comprising:

an element having a face;

a structure overlying said face, said structure including a first metal layer and a wettable metal layer overlying said first metal layer; and

a conductive trace overlying and contacting at least one of said first metal layer and said wettable metal layer, said trace having a composition different from at least one of said first metal layer and said wettable metal layer.

2. The article as claimed in claim 1, wherein said wettable metal layer overlies only a portion of said first layer, said conductive trace overlying said first layer but not said wettable metal layer.

3. The article as claimed in claim 2, wherein said conductive trace does not contact said wettable metal layer.

4. The article as claimed in claim 3, wherein said composition of said conductive trace is the same as a composition of said wettable metal layer.

5. The article as claimed in claim 2, wherein said first metal layer includes a portion disposed between an edge of said wettable metal layer and an edge of said conductive trace, said portion adapted to remain substantially unwetted by a fusible conductive material which wets said wettable metal layer.

6. The article as claimed in claim 2, wherein said first metal layer includes a portion disposed between an edge of said wettable metal layer and an edge of said conductive trace, said portion being adapted to retard a flow of a fusible conductive material which wets said wettable metal layer.

7. The article as claimed in claim 3, wherein said first metal layer includes an adhesion layer contacting said element and a barrier layer overlying said adhesion layer, said wettable metal layer overlying said barrier layer, and said conductive trace overlying said barrier layer.

8. The article as claimed in claim 7, wherein said barrier layer overlies only a portion of said adhesion layer.

9. The article as claimed in claim 1, wherein said element includes a microelectronic substrate having a contact, said contact including at least a portion of said structure.

10. The article as claimed in claim 1, wherein said element includes a semiconductor chip having a bond pad, said bond pad including at least a portion of said structure.

11. The article as claimed in claim 1, wherein said element includes a circuit panel having a terminal, said terminal including said structure.

12. The article as claimed in claim 1, wherein said wettable metal layer includes a pad region and a tongue region extending laterally from said pad region along said face, said conductive trace overlying and contacting said tongue region, said pad region and said tongue region each having length and width in directions running parallel to said face, said tongue region having width much smaller than a width of said pad region, such that said tongue region is adapted to remain substantially unwetted by a fusible conductive material which wets said pad region.

13. The article as claimed in claim 1, wherein said element includes a surface acoustic wave (SAW) device, said SAW device including a patterned metal layer including said conductive trace.

14. The article as claimed in claim 13, wherein said SAW device includes a piezoelectric device region consisting essentially of lithium tantalate, and said patterned metal layer is disposed on said device region, said patterned metal layer consisting essentially of aluminum.

15. The article as claimed in claim 1, wherein said element includes at least one of an optoelectronic device and a MEMs device.

16. The article as claimed in claim 1, wherein said conductive trace is not wettable by a fusible conductive material for which said wettable metal layer is wettable.

17. The article as claimed in claim 1, wherein said conductive trace consists essentially of a metal selected from the group consisting of aluminum, copper and gold.

18. The article as claimed in claim 1, wherein said wettable metal layer consists essentially of a metal selected from the group consisting of gold and silver.

19. The article as claimed in claim 18, wherein said barrier layer consists essentially of a metal selected from the group consisting of titanium, platinum, chromium, and nickel.

20. The article as claimed in claim 19, wherein said adhesion layer consists essentially of a metal selected titanium, chromium, and zinc.

21. A capped chip including the article as claimed in claim 1, further comprising:

a cap member having a top surface, a bottom surface opposite said top surface, and at least one through hole extending between said top and bottom surfaces, said cap member mounted to overlie said front surface of said chip; and

an electrically conductive interconnect extending from said bond pad at least partially through said through hole.

22. A method of fabricating an article, comprising:

forming a structure including a wettable metal layer overlying a face of an element; and

thereafter forming a conductive trace in contact with said structure.

23. The method as claimed in claim 22, wherein said conductive trace has a composition different from said wettable metal layer.

24. The method as claimed in claim 22, wherein said element includes a circuit panel.

25. The method as claimed in claim 22, wherein said element includes a microelectronic substrate.

26. The method as claimed in claim 22, wherein said element includes a semiconductor chip.

27. The method as claimed in claim 22, wherein said element includes a dielectric layer, and said step of forming said conductive trace includes forming a patterned metal layer overlying said dielectric layer.

28. The method as claimed in claim 22, further comprising bonding a mass of a fusible conductive material to said wettable metal layer, said mass not contacting said conductive trace.

29. The method as claimed in claim 28, wherein said step of bonding forms a bump of said fusible conductive material.

30. The method as claimed in claim 28, wherein said element is a semiconductor chip, said method further comprising mounting a cap to overlie said face of said chip, said cap having a through hole in registration with said wettable metal region, said step of bonding being performed after said step of mounting.

31. The method as claimed in claim 30, wherein said cap has an inner surface facing said chip and an outer surface opposite said inner surface, wherein said mass is formed by providing a quantity of said fusible conductive material at said outer surface and causing said fusible conductive material to flow through said through hole to wet said wettable metal layer.

32. The method as claimed in claim 31, wherein said quantity of fusible conductive material includes a solder ball.

33. The method as claimed in claim 22, further comprising flowing a fusible conductive material onto said wettable metal region, said fusible conductive material prevented from contacting said conductive trace by a shape of said wettable metal region.

34. The method as claimed in claim 22, wherein said wettable metal region includes a first metal layer and a second metal layer overlying only a portion of said first metal layer, said conductive trace overlying said first metal layer but not said second metal layer, said method further comprising flowing said fusible conductive material onto said second metal layer, said first metal layer forming a first alloy with said fusible conductive material, said first alloy having a higher melting point than a melting point of said fusible conductive material, such that said fusible conductive material is prevented from contacting said conductive trace.

35. The method as claimed in claim 34, wherein said first layer includes an adhesion layer contacting said element and a barrier layer overlying said adhesion layer, said second layer overlying at least a portion of said barrier layer.

36. The method as claimed in claim 34, wherein said conductive trace includes aluminum.

37. The method as claimed in claim 36, wherein said step of forming a conductive trace includes forming a patterned metal layer including a component of a surface acoustic wave device and said conductive trace.

38. The method as claimed in claim 22, further comprising flowing a fusible conductive material onto said wettable metal region, wherein said fusible conductive material is prevented from spreading onto said conductive trace by a shape of said wettable metal region.

39. The method as claimed in claim 34, wherein said second metal layer forms a second alloy with the fusible conductive material, said second alloy having a lower melting point than said fusible conductive material, such that said fusible conductive material spreads on contact with said second metal layer.

40. The method as claimed in claim 39, wherein said fusible conductive material is prevented from spreading vertically through said first layer by said first alloy formed with said first layer.