Packages for image sensitive electronic devices
First Claim
1. An electronic device package comprising:
- a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;
at least one electrical interconnection between the electronic device and the first end of the at least one conductive trace;
a barrier attached to the surface of the carrier substrate and forming a wall surrounding a central exposed area that contains the electronic device and the at least one electrical interconnection, wherein the barrier comprises a material that is directly adhered to the surface of the carrier substrate; and
a transparent lid covering at least a portion of the electronic device and the at least one electrical interconnection, the transparent lid having substantially the same area and configuration as the central exposed area.
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
41 Citations
26 Claims
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1. An electronic device package comprising:
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a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;
at least one electrical interconnection between the electronic device and the first end of the at least one conductive trace;
a barrier attached to the surface of the carrier substrate and forming a wall surrounding a central exposed area that contains the electronic device and the at least one electrical interconnection, wherein the barrier comprises a material that is directly adhered to the surface of the carrier substrate; and
a transparent lid covering at least a portion of the electronic device and the at least one electrical interconnection, the transparent lid having substantially the same area and configuration as the central exposed area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. The electronic device package comprising:
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a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;
at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace; and
a shell formed entirely of a transparent material attached to the surface of the carrier substrate, the shell enclosing the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An electronic device package comprising:
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a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
an electronic device sensitive to light or other radiation attached to a surface of the carrier substrate;
at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace;
a transparent lid covering a surface of the electronic device, the transparent lid having edges; and
a layer of molding compound adhered to the carrier substrate, the molding compound contacting and encapsulating the at least one electrical interconnection, a perimeter of the electronic device and the edges of the transparent lid. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification