Method for electroless deposition of a metal layer on selected portions of a substrate
First Claim
1. A method for the electroless deposition of a desired metal layer on one or more selected portions of a substrate surface, wherein the method includes the steps of:
- applying a masking layer onto the surface, said masking layer adapted to have one or more apertures formed therein so as to expose the one or more selected portions of the surface;
exposing the one or more selected portions of the surface to a colloidal suspension of catalytic particles adapted to adsorb to the substrate surface and to enhance deposition of the desired metal layer thereon; and
exposing the one or more selected portions of the surface to an ionic solution containing ions of the desired metal to enable formation of the metal layer.
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Abstract
The present invention relates to a method for electroless deposition of a metal layer on selected portions of a substrate. A preferred form of the invention relates to a method of depositing a desired metal layer, by electroless deposition, on one or more selected portions of an indium tin oxide (ITO) surface of a substrate. These selected portions are typically transparent conductive paths of ITO. The method includes a number of steps including applying a masking layer onto the surface, the masking layer having one or more apertures formed therein so as to expose the one or more selected portions of the surface: exposing the one or more selected portions of the surface to a colloidal suspension of catalytic particles adapted to adsorb to the substrate surface and to enhance deposition of the desired metal layer, and exposing the one or more selected portions of the surface to an ionic solution containing ions of the desired metal to enable formation of the metal layer.
23 Citations
33 Claims
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1. A method for the electroless deposition of a desired metal layer on one or more selected portions of a substrate surface, wherein the method includes the steps of:
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applying a masking layer onto the surface, said masking layer adapted to have one or more apertures formed therein so as to expose the one or more selected portions of the surface;
exposing the one or more selected portions of the surface to a colloidal suspension of catalytic particles adapted to adsorb to the substrate surface and to enhance deposition of the desired metal layer thereon; and
exposing the one or more selected portions of the surface to an ionic solution containing ions of the desired metal to enable formation of the metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 33)
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32. A method for the electroless deposition of a desired metal layer on one or more selected portions of a substrate surface, substantially as herein before described with reference to any one or more of the drawings.
Specification