Thermal treatment of solution-processed organic electroactive layer in organic electronic device

• US 20050118455A1
• Filed: 09/24/2004
• Published: 06/02/2005
• Est. Priority Date: 06/20/2000
• Status: Abandoned Application

• Current Assignee: Chi Zhang
• Original Assignee: Chi Zhang
• Inventors: Zhang, Chi
• Application Number:
  US10/949,750
• Publication Number:
  US 20050118455A1
• Time in Patent Office: Days
• US Class Current: 428/690
• CPC Class Codes: H10K 50/11 characterised by the electroluminescent [EL] layers
• CPC Class Codes: H10K 50/14 Carrier transporting layers
• CPC Class Codes: H10K 50/17 Carrier injection layers
• CPC Class Codes: H10K 50/171 Electron injection layers
• CPC Class Codes: H10K 71/10 Deposition of organic active material
• CPC Class Codes: H10K 71/12 using liquid deposition, e.g. spin coating
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Heat treatment of conductive polymer buffer layers results in increased resistance and thus improved interpixel isolation in polymer light emitting device arrays. Heat treatment of luminescent layers results in improved lifetimes for polymer light emitting device arrays.

Claims

1-16. -16. (canceled)

17. A method for preparing a organic electronic device comprising the steps of:

a. depositing a conductive electrical contact layer on a solid substrate,

b. depositing a buffer layer comprising a solution-processed organic electroactive material on said conductive electrical contact layer,

c. heat-treating said buffer layer,

d. depositing an photoactive layer onto the heat-treated buffer layer, and

e. depositing an electron-injecting layer onto the photoactive layer.

18. The method of claim 17 wherein the heat-treating is at a temperature and for a period which results in a conductivity of the buffer layer of less than 10⁻

6 S/cm.

19. The method of claim 17 wherein the solution-processed organic electroactive material is polyaniline.

20. The method of claim 17 wherein the solution-processed organic electroactive material is polyaniline in the emeraldine salt form.

21. The method of claim 17 wherein the heat-treating is carried out at a temperature of from about 100°

C. to about 300°

C. for a time period of from about 0.5 minutes to about 90 minutes.

51. A device made by the method of claim 17, 22, 26, 31, 36, 37 or 38.

22. A method for making an organic electronic device comprising the steps of:

a. depositing a conductive electrical contact layer on a solid substrate,

b. optionally depositing a buffer layer comprising conductive conjugated organic polymer on said conductive electrical contact layer,

c. depositing an photoactive layer on said buffer layer,

d. heat-treating said photoactive layer and the buffer layer, and

e. depositing an electron-injecting layer onto the heat-treated photoactive layer.

23. The method of claim 22 wherein the emissive polymer layer is heat-treated at a temperature and for a period which results in an increase in diode operating life of at least about 50%.

24. The method of claim 22 wherein the emissive polymer layer comprises an electroluminescent conjugated organic polymer.

25. The method of claim 22 wherein the emissive polymer layer is heat-treated at a temperature of from about 80°

C. to about 250°

C. for a time period of from about 1 minute to about 3 minutes.

26. A method for preparing an organic electronic device comprising the steps of:

a. depositing a conductive electrical contact layer on a solid substrate,

b. optionally depositing a buffer layer comprising solution-processed organic electroactive material on said conductive electrical contact layer,

c. optionally heat-treating said buffer layer,

d. depositing an photoactive layer onto the heat-treated buffer layer,

e. heat-treating the photoactive layer, and

f. depositing an electron-injecting layer onto the photoactive layer.

27. The method of claim 26 wherein the heat-treating of the buffer is at a temperature and for a period which results in a conductivity of the buffer layer of less than 10⁻

6 S/cm.

28. The method of claim 26 wherein the solution-processed organic electroactive material is polyaniline.

29. The method of claim 26 wherein the solution-processed organic electroactive material is polyaniline in the emeraldine salt form.

30. The method of claim 26 wherein the heat-treating of the buffer layer is carried out at a temperature of from about 100°

C. to about 300°

C. for a time period of from about 0.5 minutes to about 90 minutes.

31. A method for making an organic electronic device comprising the steps of:

a. depositing a conductive electrical contact layer on a solid substrate,

b. optionally depositing a buffer layer comprising solution-processed organic electroactive material on said conductive electrical contact layer,

c. depositing an photoactive layer onto the heat-treated buffer layer, and

d. depositing an electron-injecting layer onto the emmisive layer, and

e. heat treating the resulting structure.

32. A method of claim 31 wherein the heat-treating of the buffer is at a temperature and for a period which results in a conductivity of the buffer layer of less than 10⁻

6 S/cm.

33. The method of claim 31 wherein the solution-processed organic electroactive material is polyaniline.

34. The method of claim 31 wherein the solution-processed organic electroactive material is polyaniline in the emeraldine salt form.

35. The method of claim 31 wherein the heat-treating of the buffer layer is carried out at a temperature of from about 100°

C. to about 300°

C. for a time period of from about 0.5 minutes to about 90 minutes.

36. A method for making an organic electronic device comprising the steps of:

a. depositing an electron-injecting layer onto a solid substrate,

b. depositing an photoactive layer onto the electron-injecting layer,

c. heat-treating said photoactive layer,

d. optionally depositing a buffer layer comprising solution-processed organic electroactive material on the heat-treated photoactive layer, and

e. depositing a hole-injecting layer onto the optional buffer layer where present or on the heat-treated photoactive layer.

37. A method for preparing an organic electronic device comprising the steps of:

a. depositing an electron-injecting layer onto a solid substrate,

b. depositing an photoactive layer onto the electron-injecting layer

c. optionally depositing a buffer layer comprising solution-processed organic electroactive material on the photoactive layer,

d. optionally heat-treating said buffer layer, and

e. depositing a hole-injecting layer onto the optional buffer layer where present or the photoactive layer.

38. A method for making an organic electronic device comprising the steps of:

a. depositing an electron-injecting layer onto a solid substrate,

b. depositing an photoactive layer onto the electron-injecting layer

c. heat-treating said photoactive layer,

d. depositing a buffer layer comprising solution-processed organic electroactive material on the heat-treated photoactive layer,

e. heat-treating the buffer layer, and

depositing a hole-injecting layer onto the heat-treated buffer layer.

39. A method for making an organic electronic device containing a first electrode, a second electrode, and at least one electroactive layer between the first and second electrodes, the steps comprising:

a. providing the first electrode;

b. providing the at least one electroactive layer, one or more of said at least one electroactive layer is a solution-processed organic electroactive layer;

c. heat-treating one or more of the solution-processed electroactive layer; and

d. providing the second electrode.

40-50. -50. (canceled)