Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces, and SOI substrates and devices fabricated thereby
First Claim
1. A method for fabricating an SOI substrate, comprising:
- forming a stack pattern including a sacrificial layer and an active semiconductor layer in sequence on a substrate, the sacrificial layer being formed of a material having etch selectivity with respect to the substrate and the active semiconductor layer;
forming a supporting pattern contacting at least two sides of the stack pattern on the substrate that exposes at least one side of the sacrificial layer and the active semiconductor layer on at least one side of the stack pattern; and
selectively etching the sacrificial layer through at least one side thereof that is exposed, to form a void space between the substrate and the active semiconductor layer.
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Accused Products
Abstract
An SOI substrate is fabricated by providing a substrate having a sacrificial layer thereon, an active semiconductor layer on the sacrificial layer remote from the substrate and a supporting layer that extends along at least two sides of the active semiconductor layer and the sacrificial layer and onto the substrate, and that exposes at least one side of the sacrificial layer. At least some of the sacrificial layer is etched through the at least one side thereof that is exposed by the supporting layer to form a void space between the substrate and the active semiconductor layer, such that the active semiconductor layer is supported in spaced-apart relation from the substrate by the supporting layer. The void space may be at least partially filled with an insulator lining.
24 Citations
47 Claims
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1. A method for fabricating an SOI substrate, comprising:
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forming a stack pattern including a sacrificial layer and an active semiconductor layer in sequence on a substrate, the sacrificial layer being formed of a material having etch selectivity with respect to the substrate and the active semiconductor layer;
forming a supporting pattern contacting at least two sides of the stack pattern on the substrate that exposes at least one side of the sacrificial layer and the active semiconductor layer on at least one side of the stack pattern; and
selectively etching the sacrificial layer through at least one side thereof that is exposed, to form a void space between the substrate and the active semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for fabricating an SOI substrate, comprising:
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forming a supporting pattern on a substrate that exposes a portion of the substrate;
forming a sacrificial layer and an active semiconductor layer in sequence on the exposed portion of the substrate, such that at least two sides of the sacrificial layer and the active layer come into contact with the supporting pattern and at least one side of the sacrificial layer and the active semiconductor layer are exposed, the sacrificial layer being formed of a material having etch selectivity with respect to the substrate and the active semiconductor layer; and
forming a void space between the substrate and the active semiconductor layer by selectively removing the sacrificial layer through at least one side thereof that is exposed. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method for fabricating a semiconductor device, comprising:
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epitaxially growing a sacrificial layer and an active semiconductor layer on a substrate in sequence, with the sacrificial layer being formed of a material having etch selectivity with respect to the substrate and the active semiconductor layer;
patterning the active layer and the sacrificial layer to expose portions of the substrate in a device isolation region;
forming a first device isolation layer contacting at least two sides of the patterned active semiconductor layer and sacrificial layer on the exposed portions of the substrate;
exposing at least one side of the active semiconductor layer and the sacrificial layer;
forming a void space between the substrate and the active semiconductor layer by selectively removing the sacrificial layer through at least one side thereof that is exposed, with the first device isolation layer being used as a supporting layer of the active layer;
forming a second device isolation layer to cover the exposed side of the active semiconductor layer and the void space; and
forming a gate electrode on the active layer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for fabricating a semiconductor device, comprising:
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forming an insulating layer on a device isolation region on a substrate that exposes a portion of the substrate;
forming a sacrificial layer and an active semiconductor layer in sequence on the exposed portion of the substrate, such that at least two sides of the sacrificial layer and active layer come into contact with the insulating layer, the sacrificial layer being formed of a material having etch selectivity with respect to the substrate and the active semiconductor layer;
patterning the insulating layer to form a first device isolation layer that covers at least two sides of the sacrificial layer and the active semiconductor layer and that exposes at least one side of the sacrificial layer and the active semiconductor layer;
forming a void space between the substrate and the active semiconductor layer by selectively removing the sacrificial layer through the at least one side thereof that is exposed, with the first device isolation layer being used as a supporting layer of the active layer;
forming a second device isolation layer to cover the at least one exposed side of the active semiconductor layer and the void space; and
forming a gate electrode on the active layer. - View Dependent Claims (28, 29, 30, 31, 32)
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33. A method for fabricating a semiconductor device, comprising:
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forming a first device isolation layer that covers portions of a device isolation region on a substrate and that exposes a portion of the substrate;
forming a sacrificial layer and an active semiconductor layer in sequence on the exposed portion of the substrate, such that at least two sides of the sacrificial layer and the active semiconductor layer come into contact with the first device isolation layer, the sacrificial layer being formed of a material having etch selectivity with respect to the semiconductor substrate and the active layer;
selectively etching the active layer and the sacrificial layer that are not in contact with the first device isolation layer to expose at least one other side of the sacrificial layer and the active layer;
forming a void space between the semiconductor substrate and the active layer by selectively removing the sacrificial layer through the at least one other side of the sacrificial layer, with the first device isolation layer being used as a supporting layer of the active layer;
forming a second device isolation layer that covers the exposed sides of the active semiconductor layer and the void space; and
forming a gate electrode on the active layer. - View Dependent Claims (34, 35, 36, 37, 38)
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39. A semiconductor device, comprising:
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a semiconductor substrate;
a device isolation layer on the semiconductor substrate; and
an active semiconductor layer spaced apart from the semiconductor substrate with a void space interposed therebetween, supported by the device isolation layer, and having a lattice constant close to that of the semiconductor substrate. - View Dependent Claims (40, 41, 42, 43, 44)
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45. A method for fabricating an SOI substrate comprising:
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providing a substrate having a sacrificial layer thereon, an active semiconductor layer on the sacrificial layer remote from the substrate and a supporting layer that extends along at least two sides of the active semiconductor layer and the sacrificial layer and onto the substrate, and that exposes at least one side of the sacrificial layer; and
etching at least some of the sacrificial layer through the at least one side thereof that is exposed by the supporting layer to form a void space between the substrate and the active semiconductor layer, such that the active semiconductor layer is supported in spaced-apart relation from the substrate by the supporting layer. - View Dependent Claims (46, 47)
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Specification