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Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations

  • US 20050118832A1
  • Filed: 12/01/2003
  • Published: 06/02/2005
  • Est. Priority Date: 12/01/2003
  • Status: Abandoned Application
First Claim
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1. A sacrificial silicon-containing layer etching composition, comprising a supercritical fluid (SCF), at least one co-solvent, at least one etchant species, and optionally at least one surfactant.

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