Magnetic thin film inductors

• US 20050120543A1
• Filed: 11/09/2004
• Published: 06/09/2005
• Est. Priority Date: 12/11/2001
• Status: Abandoned Application

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Yang, Chungsheng, Wang, Xingwu
• Application Number:
  US10/985,159
• Publication Number:
  US 20050120543A1
• Time in Patent Office: Days
• US Class Current: 29/602.100
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/06 with core substantially closed in itself, e.g. toroid
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

The present invention relates to inductors with improved inductance and quality factor. In one embodiment, a magnetic thin film inductor is disclosed. In this embodiment, magnetic thin film inductor includes a plurality of elongated conducting regions and magnetic material. The plurality of elongated conducting regions are positioned parallel with each other and at a predetermined spaced distance apart from each other. The magnetic material encases the plurality of conducting regions, wherein when currents are applied to the conductors, current paths in each of the conductors cause the currents to generally flow in the same direction thereby enhancing mutual inductance.

Claims

1. A method of forming a magnetic thin film inductor, the method comprising:

forming a first layer of magnetic material on a substrate;

forming a layer of conducting material overlaying the first layer of magnetic material;

patterning the conductive layer to form two or more generally parallel conducting members, wherein the two or more conductive members are positioned proximate each other; and

forming a second layer of magnetic material overlaying the conductive members and portions of the first layer of magnetic material, wherein the conductive members are encased by the first and second layers of magnetic material.

2. The method of claim 1, further comprising:

forming gaps in the first and second layers of magnetic material.

3. The method of claim 1, further comprising:

forming a first layer of insulator overlaying the first layer of magnetic material; and

forming a second layer of insulator overlaying the two or more conductive members, wherein the first and second layers of insulator are positioned between the first and second layers of magnetic material and the two or more conductive members.

4. The method of claim 1, wherein the steps of forming the first and second layers of magnetic material further comprising:

forming two or more layers of different types of magnetic material.

5. A method of forming a magnetic thin film inductor, the method comprising:

forming a first layer of magnetic material on a substrate;

forming a layer of conductive material overlaying the first layer of magnetic material;

patterning the conductive material to form one or more turns of a conductive member in a predefine shape;

forming a second layer of magnetic material overlaying the one or more turns of the conductive member and the first layer of magnetic material; and

removing portions of the first and second layers of magnetic material to form a central opening to the substrate, wherein the first and second layers of magnetic material encase the one or more conducting members that extend around the central opening.

6. The method of claim 5, further comprising:

removing further portions of the first and second layers of magnetic material encasing the conducting member adjacent curves in the one or more turns.

7. The method of claim 5, further comprising:

forming a layer of insulation material between the one or more turns of the conducting member and the first and second layers of magnetic material.

8. The method of claim 5, wherein the shape of the one or more turns of the conducting member are patterned into a generally regular polygonal shape.

9. The method of claim 5, wherein the one or more turns of the conducting member is patterned into an arbitrary shape.

10. The method of claim 5, further comprising:

removing further portions of the first and second layers of magnetic material that encase the one or more turns of the conducting member to form a plurality of gaps in the first and second layers of magnetic material.

11. The method of claim 11, wherein the gaps are positioned generally perpendicular to a path of the one or more conducting members.

12. A method of operating a magnetic thin film inductor in an integrated circuit, the method comprising:

coupling a current to a plurality of conducting members positioned generally parallel with each other and encased by sections of magnetic material, wherein each section of magnetic material encases a plurality of conducting members in which current is flowing in generally the same direction.

13. The method of claim 12, wherein the sections of magnetic material do not encase portions of the plurality of conducting members that bend in direction.