Method for forming MEMS grid array connector

• US 20050120553A1
• Filed: 12/08/2003
• Published: 06/09/2005
• Est. Priority Date: 12/08/2003
• Status: Abandoned Application

• Current Assignee: EPIC Technologies Incorporated
• Original Assignee: EPIC Technologies Incorporated
• Inventors: Brown, Dirk D., Williams, John D., Radza, Eric M.
• Application Number:
  US10/731,213
• Publication Number:
  US 20050120553A1
• Time in Patent Office: Days
• US Class Current: 29/884
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 13/2407 : characterized by the resilient means
• CPC Class Codes: H01R 13/2492 : multiple contact points
• CPC Class Codes: H01R 43/007 : for elastomeric connecting elements
• CPC Class Codes: H01R 43/205 : with a panel or printed circuit board
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A method for forming a connector including an array of contact elements includes forming a support layer on a substrate, patterning the support layer to define an array of support elements, isotropically etching the support elements to form rounded corners on the top of each support element, forming and patterning a metal layer to define an array of contact elements where each contact element includes a first metal portion on the substrate and a second metal portion extending from the first metal portion and partially across the top of a respective support element, and removing the support elements. The contact elements thus formed each includes a base portion attached to the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to have a concave curvature with respect to the surface of the substrate.

Claims

1. A method for forming a connector including a plurality of contact elements, the method comprising:

providing a substrate;

forming a support layer on the substrate;

patterning the support layer to define a plurality support elements;

isotropically etching the plurality of support elements to form rounded corners on the top of each support element;

forming a metal layer on the substrate and on the plurality of support elements;

patterning the metal layer to define a plurality of contact elements, wherein each contact element includes a first metal portion on the substrate and a second metal portion extending from the first metal portion and partially across the top of a respective support element;

removing the plurality of support elements,

wherein the plurality of contact elements thus formed each includes a base portion attached to the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate, the curved spring portion being formed to have a concave curvature with respect to the surface of the substrate.

2. The method of claim 1, wherein forming a support layer on the substrate comprises:

depositing a layer of dielectric material.

3. The method of claim 2, wherein the dielectric material comprises a spin on glass layer, a TEOS layer, or a PCVD oxide layer.

4. The method of claim 1, wherein patterning the support layer to define a plurality of support elements comprises:

forming a mask layer over the support layer;

patterning the mask layer to define locations for the plurality of support elements;

anisotropically etching the support layer using the patterned mask layer; and

removing the patterned mask layer.

5. The method of claim 2, wherein isotropically etching the plurality of support elements comprises:

plasma etching the plurality of support elements using an etch chemistry capable of etching the dielectric material.

6. The method of claim 2, wherein isotropically etching the plurality of support elements comprises:

wet etching the plurality of support elements using an etchant capable of etching the dielectric material.

7. The method of claim 1, wherein forming a metal layer on the substrate comprises:

depositing a metal layer on the substrate.

8. The method of claim 7, wherein the depositing uses a chemical vapor deposition process, a physical vapor deposition process, an electro plating process, or a sputtering process.

9. The method of claim 1, wherein patterning the metal layer to define a plurality of contact elements comprises:

forming a mask layer over the metal layer;

patterning the mask layer to define locations for the plurality of contact elements;

etching the metal layer using the patterned mask layer; and

removing the patterned mask layer.

10. The method of claim 1, wherein removing the plurality of support elements comprises:

wet etching to remove the plurality of support elements.

11. The method of claim 1, wherein the curved spring portion of each contact element is formed to curve away from a plane of contact and having a curvature disposed to provide a controlled wiping action when the contact element engages a respective pad of a semiconductor device.

12. The method of claim 1, wherein the act of patterning the metal layer to define a plurality of contact elements comprises:

defining a first contact element including a first metal portion on the substrate and a second metal portion extending in a spiral configuration from the first metal portion and partially across the top of a respective support element.

13. The method of claim 1, wherein the patterning the metal layer to define a plurality of contact elements comprises:

defining a first contact element including a first metal portion on the substrate and proximate to a first end of a first support element and a second metal portion extending from the first metal portion and partially across the top of the first support element; and

defining a second contact element including a first metal portion on the substrate and proximate to a second end of a second support element, the second end opposite the first end, and a second metal portion extending from the first metal portion and partially across the top of the second support element,

wherein the first contact element and the second contact element thus formed have respective distal ends facing each other.

14. The method of claim 1, wherein the patterning the metal layer to define a plurality of contact elements comprises:

defining a first contact element including a first metal portion on the substrate and proximate to a first end of a first support element and a second metal portion extending from the first metal portion and partially across the top of the first support element; and

defining a second contact element including a first metal portion on the substrate and proximate to a second end of a second support element, the second end proximate to the first end of the first support element, and a second metal portion extending from the first metal portion and partially across the top of the second support element,

wherein the first contact element and the second contact element thus formed have jointed base portions and have respective distal ends facing away from each other.

15. A method for forming a connector including a plurality of contact elements, the method comprising:

providing a substrate;

providing a conductive adhesion layer on the substrate;

forming a support layer on the conductive adhesion layer;

patterning the support layer to define a plurality support elements;

isotropically etching the plurality of support elements to form rounded corners on the top of each support element;

forming a metal layer on the conductive adhesion layer and on the plurality of support elements;

patterning the metal layer and the conductive adhesion layer to define a plurality of contact elements, wherein each contact element includes a first metal portion formed on a conductive adhesion portion and a second metal portion extending from the first metal portion and partially across the top of a respective support element; and

removing the plurality of support elements,

wherein the plurality of contact elements thus formed each includes a base portion attached to the conductive adhesion portion which is attached to the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate, the curved spring portion being formed to have a concave curvature with respect to the surface of the substrate.

16. The method of claim 15, wherein patterning the support layer to define a plurality of support elements comprises:

forming a mask layer over the support layer;

patterning the mask layer to define locations for the plurality of support elements;

anisotropically etching the support layer using the patterned mask layer, the anisotropically etching stopping on or in the conductive adhesion layer; and

removing the patterned mask layer.

17. The method of claim 15, wherein patterning the metal layer and the conductive adhesion layer to define a plurality of contact elements comprises:

forming a mask layer over the metal layer;

patterning the mask layer to define locations for the plurality of contact elements;

etching the metal layer using the patterned mask layer;

etching the conductive adhesion layer using the patterned mask layer and the plurality of support elements; and

removing the patterned mask layer.

18. The method of claim 15, wherein the support layer comprises a dielectric layer and isotropically etching the plurality of support elements comprises:

plasma etching the plurality of support elements using an etch chemistry capable of etching the dielectric material.

19. The method of claim 15, wherein the support layer comprises a dielectric layer and isotropically etching the plurality of support elements comprises:

wet etching the plurality of support elements using an etchant capable of etching the dielectric material.

20. The method of claim 15, wherein forming a metal layer on the substrate comprises:

depositing a metal layer on the substrate using a process selected from a chemical vapor deposition process, a physical vapor deposition process, an electro plating process, or a sputtering process.