Structurally sealed heat sink

• US 20050121175A1
• Filed: 02/09/2004
• Published: 06/09/2005
• Est. Priority Date: 12/05/2003
• Status: Abandoned Application

• Current Assignee: Tai-Sol Electronics Co., Ltd.
• Original Assignee: Tai-Sol Electronics Co., Ltd.
• Inventors: Lai, Yaw-Huey
• Application Number:
  US10/773,151
• Publication Number:
  US 20050121175A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A structurally sealed heat sink is composed of a main body, at least one sealing member, and at least one solder unit. The main body includes a chamber inside, a capillary layer adhered to a peripheral surface of said chamber, and at least one opening having a predetermined depth to define a peripheral wall of a predetermined height. The sealing member that is identical to the opening in number includes an intersection intersected with the opening for the predetermined depth, a solder ditch formed between the sealing member and the main body, and an annular groove formed between the peripheral wall and an outer periphery of the sealing member. The solder unit that is identical to the opening in number is disposed inside the solder ditch.

Claims

1. A structurally sealed heat sink comprising:

a main body having a chamber inside, a capillary layer disposed around a peripheral surface of said chamber, at least one opening formed for a predetermined depth, and a peripheral wall formed around said opening for a predetermined height;

at least one sealing member being the same with said opening in number and having an intersection intersected with said opening for the predetermined depth, a solder ditch being formed between said sealing member and said main body, an annular groove being formed between said peripheral wall and an outer periphery of said sealing member; and

at least one solder unit being the same with said opening in number and disposed in said solder ditch.

2. The heat sink as defined in claim 1, wherein said solder ditch is recessed around an end of said opening of said main body.

3. The heat sink as defined in claim 1, wherein said solder ditch is recessed around a periphery of said sealing member.

4. The heat sink as defined in claim 1, wherein said annular groove is recessed around a periphery of said sealing member.

5. The heat sink as defined in claim 1, wherein said annular groove is recessed on said main body.

6. The heat sink as defined in claim 1, wherein said main body is a metallic block;

said sealing member is a heat pipe having a free end mounted to said opening of said main body.

7. The heat sink as defined in claim 1, wherein said main body is a metallic block;

said sealing member is a stopping barrel member mounted to said opening of said main body.

8. The heat sink as defined in claim 1, wherein said main body is a heat pipe;

said sealing member is a piston barrel mounted to said opening of said main body.

9. The heat sink as defined in claim 1, wherein said main body is a heat pipe;

said sealing member is a sleeve fitted to said opening of said main body.