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Wiring substrate, semiconductor device, and method for manufacturing thereof

  • US 20050121675A1
  • Filed: 10/27/2004
  • Published: 06/09/2005
  • Est. Priority Date: 10/28/2003
  • Status: Active Grant
First Claim
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1. A wiring substrate comprising:

  • a porous film; and

    a conductive layer on the porous film.

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