Microelectronic device having disposable spacer
First Claim
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1. A method of manufacturing a microelectronic device, comprising:
- forming a patterned feature over a substrate;
depositing a conformal polymer layer over the patterned feature and the substrate, employing a fluorine-containing plasma source; and
etching the polymer layer to expose the patterned feature and a portion of the substrate, thereby forming polymer spacers on opposing sides of the patterned feature.
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Abstract
A method of manufacturing a microelectronic device comprising forming a patterned feature over a substrate and employing a fluorine-containing plasma source to deposit a conformal polymer layer over the patterned feature and the substrate. The polymer layer is etched to expose the patterned feature and a portion of the substrate, thereby forming polymer spacers on opposing sides of the patterned feature.
98 Citations
36 Claims
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1. A method of manufacturing a microelectronic device, comprising:
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forming a patterned feature over a substrate;
depositing a conformal polymer layer over the patterned feature and the substrate, employing a fluorine-containing plasma source; and
etching the polymer layer to expose the patterned feature and a portion of the substrate, thereby forming polymer spacers on opposing sides of the patterned feature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A microelectronic device, comprising:
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a substrate;
a patterned feature located over the substrate;
polymer spacers containing fluorine and located on opposing sides of the patterned feature. - View Dependent Claims (35)
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36. A integrated circuit device, comprising:
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a substrate;
a plurality of microelectronic devices each comprising;
a patterned feature located over the substrate; and
polymer spacers containing fluorine and located on opposing sides of the patterned feature; and
at least one interconnect electrically connecting ones of the plurality of microelectronic devices.
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Specification