Stackable integrated circuit packaging

• US 20050121764A1
• Filed: 12/04/2003
• Published: 06/09/2005
• Est. Priority Date: 12/04/2003
• Status: Active Grant

• Current Assignee: Tahoe Research Limited (f/k/a Learndale Limited) (Vector Capital Corporation)
• Original Assignee: Intel Corporation
• Inventors: Mallik, Debendra, Swan, Johanna, Ichikawa, Kinya, Sterrett, Terry L.
• Granted Patent: US 7,345,361 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.

Claims

1. An apparatus comprising:

an integrated circuit die;

an integrated circuit package coupled to the integrated circuit die;

mold compound in contact with the integrated circuit die and the integrated circuit package; and

an interconnect coupled to the integrated circuit package,

wherein a first portion of the interconnect is in contact with the mold compound, wherein a second portion of the interconnect is not in contact with the mold compound, and wherein a third portion of the interconnect is in contact with the integrated circuit package.

2. An apparatus according to claim 1, wherein the second portion is an upper portion of the interconnect and the third portion is a lower portion of the interconnect.

3. An apparatus according to claim 1, further comprising:

a second integrated circuit package;

a second interconnect coupled to the second integrated circuit package,

wherein the second interconnect is coupled to the first interconnect.

4. An apparatus according to claim 3, wherein the second integrated circuit package is coupled to the mold compound.

5. An apparatus according to claim 3, further comprising:

a second integrated circuit die coupled to the second integrated circuit package;

second mold compound in contact with the second integrated circuit die and the second integrated circuit package; and

a third interconnect coupled to the second integrated circuit package,

wherein a first portion of the third interconnect is in contact with the second mold compound, and wherein a second portion of the third interconnect is not in contact with the second mold compound, and wherein a third portion of the third interconnect is in contact with the second integrated circuit package.

6. An apparatus according to claim 5, further comprising:

a third integrated circuit package;

a fourth interconnect coupled to the third integrated circuit package,

wherein the fourth interconnect is coupled to the third interconnect.

7. An apparatus according to claim 1, further comprising:

a second integrated circuit die coupled to the integrated circuit die, in contact with the mold compound, and electrically coupled to the integrated circuit package.

8. An apparatus comprising:

an integrated circuit package substrate;

a plurality of integrated circuit die coupled to the integrated circuit package substrate;

mold compound in contact with the plurality of integrated circuit die and the integrated circuit package substrate; and

an interconnect coupled to the integrated circuit package substrate and electrically coupled to one of the plurality of integrated circuit die,

wherein a first portion of the interconnect is in contact with the mold compound, wherein a second portion of the interconnect is not in contact with the mold compound, and wherein a third portion of the interconnect is in contact with the integrated circuit package.

9. An apparatus according to claim 8, further comprising:

underfill material disposed between the first face of each of the plurality of integrated circuit die and the integrated circuit package substrate.

10. An apparatus according to claim 8, further comprising:

a second integrated circuit die coupled to the integrated circuit die, in contact with the mold compound, and electrically coupled to the integrated circuit package.

11. A method comprising:

coupling an interconnect to an integrated circuit package;

placing an integrated circuit die on the integrated package; and

placing mold compound on the integrated circuit package and in contact with the integrated circuit die,

wherein a first portion of the interconnect is in contact with the mold compound, wherein a second portion of the interconnect is not in contact with the mold compound, and wherein a third portion of the interconnect is in contact with the integrated circuit package.

12. A method according to claim 11, wherein placing the mold compound on the integrated circuit package comprises placing the mold compound over the interconnect, and further comprising:

removing mold compound from an upper portion of the interconnect to expose the upper portion.

13. A method according to claim 11, further comprising:

coupling a second interconnect to the first interconnect, the second interconnect coupled to a second integrated circuit package.

14. A method according to claim 13, further comprising the second integrated circuit to the mold compound.

15. A system comprising:

an integrated circuit die;

an integrated circuit package coupled to the integrated circuit die;

mold compound in contact with the integrated circuit die and the integrated circuit package; and

an interconnect coupled to the integrated circuit package; and

a double data rate memory electrically coupled to the integrated circuit die,

wherein a first portion of the interconnect is in contact with the mold compound, wherein a second portion of the interconnect is not in contact with the mold compound, and wherein a third portion of the interconnect is in contact with the integrated circuit package.

16. A system according to claim 15, further comprising:

a second integrated circuit die;

a second integrated circuit package coupled to the second integrated circuit die;

a second interconnect coupled to the second integrated circuit package,

wherein the second interconnect is coupled to the first interconnect.

17. A system according to claim 16, wherein the second integrated circuit package is coupled to the mold compound.

18. A system according to claim 15, further comprising:

a second integrated circuit die coupled to the integrated circuit die, in contact with the mold compound, and electrically coupled to the integrated circuit package.

19. A system according to claim 15, further comprising:

a motherboard electrically coupled to the integrated circuit die and to the memory.