Thinned die integrated circuit package
First Claim
Patent Images
1. An integrated circuit package, comprising:
- a heat spreader having a planar surface; and
a thinned semiconductor die mounted on the planar surface of said heat spreader.
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Abstract
A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
33 Citations
31 Claims
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1. An integrated circuit package, comprising:
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a heat spreader having a planar surface; and
a thinned semiconductor die mounted on the planar surface of said heat spreader. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of fabricating an integrated circuit package, comprising:
mounting a thinned semiconductor die on a planar surface of a heat spreader. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of fabricating an integrated circuit package, comprising:
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providing a planar heat spreader;
mounting a plurality of thinned semiconductor dice on to planar surface of said heat spreader to form a plurality of conjoined microelectronic packages; and
singulating said plurality of conjoined microelectronic packages by cutting through the heat spreader. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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Specification