Internally reinforced bond pads
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Accused Products
Abstract
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
61 Citations
14 Claims
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1-7. -7. (canceled)
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8. A method of forming internally reinforced bond pads, the method comprising the steps of:
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forming a metallic layer on a substrate;
forming a first dielectric layer over the metallic layer;
patterning a first portion of the first dielectric layer so as to form at least one through via to the metallic layer and a plurality of spaced-apart dielectric structures, a second portion of the first dielectric layer being unpatterned;
conformally depositing a metallic bond layer over the spaced-apart dielectric structures and into the through via such that the spaced-apart dielectric structures are substantially reproduced in the metallic bond layer as spaced-apart metallic structures;
forming a second dielectric layer over the spaced-apart metallic structures and the unpatterned portion of the first dielectric layer; and
removing substantially all of the second dielectric layer over the spaced-apart metallic structures except for a ring of dielectric material surrounding each of the spaced-apart metallic structures. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of forming internally reinforced bond pads, the method comprising the steps of:
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forming a metallic layer on a substrate;
forming a first dielectric layer over the metallic layer;
patterning a first portion of the first dielectric layer so as to form at least one through via to the metallic layer and a plurality of spaced-apart dielectric structures, a second portion of the first dielectric layer being unpatterned;
conformally depositing a metallic bond layer over the spaced-apart dielectric structures and into the through via such that the spaced-apart dielectric structures are substantially reproduced in the metallic bond layer as spaced-apart metallic structures;
forming a second dielectric layer over the spaced-apart metallic structures and the unpatterned portion of the first dielectric layer; and
removing substantially all of the second dielectric layer from the spaced-apart metallic structures so as to expose the spaced-apart metallic structures except for a ring of dielectric material surrounding each of the spaced-apart metallic structures.
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Specification