Circuit insulation methods and systems for vehicle door latches

• US 20050121829A1
• Filed: 12/03/2003
• Published: 06/09/2005
• Est. Priority Date: 12/03/2003
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Hayes, Richard T., Murchle, Duncan S., Valdhyanathan, Ajaykumar, Spurr, Nigel V., Johnson, Curtis B., Gibson, Hugh D., Kilker, Daniel D., Vorwald, Scott A., Kettle, Adrian T., Bechtold, Kenneth V., Crawford, Alex, Eaton, William F., Maxwell, Abanni B., Shelley, Michael J., Shannon, Patrick H., Madden, Gillian J.
• Application Number:
  US10/727,242
• Publication Number:
  US 20050121829A1
• Time in Patent Office: Days
• US Class Current: 264/272.110
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: E05B 17/0004 Lock assembling or manufacturing making locksmith's goods of sheet metal B21D53/38; assembling in general B23P21/00
• CPC Class Codes: E05B 77/34 Protection against weather or dirt, e.g. against water ingress closures or guards for keyholes E05B17/14
• CPC Class Codes: E05B 81/54 Electrical circuits for locking several wings simultaneously E05B77/48
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

An injection molding method and system for an electrical circuit utilized in vehicle door latch mechanisms is disclosed herein. A mold is generally provided in which a mold cavity is formed therein from walls of the mold. An electrical circuit associated with vehicle door latch and/or integrated with the vehicle door latch can be located within the mold cavity. A plastics material can then be injection molded into the mold cavity of the mold, wherein the plastics material covers and seals the electrical circuit to provide insulation and environmental protection to the electrical circuit.

Claims

1. An injection molding method, comprising the steps of:

providing a mold having a mold cavity formed therein;

locating an electrical circuit within said mold cavity, wherein said electrical circuit comprises electrical components assembled to an electrical circuit board prior to any molding operations thereof;

injection molding a plastics material into said mold cavity of said mold, wherein said plastics material covers and seals said electrical circuit to provide insulation and environmental protection to said electrical circuit.

2. The method of claim 1 further comprising the step of:

integrating said electrical circuit with a latch mechanism, wherein said electrical circuit communicates electrically with said latch mechanism.

3. The method of claim 1 further comprising the step of:

configuring said mold to provide a mold form geometry that permits a plurality of components to be connected electrical to said electrical circuit and an associated latch mechanism after said injection molding of said plastics material into said mold cavity.

4. The method of claim 3 further comprising the step of:

configuring said mold form geometry to comprise at least one gap in which an additional component can be located.

5. The method of claim 3 further comprising the step of:

configuring said mold form geometry to possess at least one mounting surface feature.

6. The method of claim 3 further comprising the step of:

configuring said mold form geometry to possess at least one pivot feature.

7. The method of claim 3 further comprising the step of:

configuring said mold form geometry to possess at least one flange feature.

8. The method of claim 3 further comprising the step of:

configuring said mold form geometry to possess at least one seal feature.

9. The method of claim 3 further comprising the step of:

configuring said mold form geometry to possess at least one mating feature.

13. The system of claim 1 further comprising:

said electrical circuit integrated with a latch mechanism, wherein said electrical circuit communicates electrically with said latch mechanism.

10. An injection molding method for electrical circuit, said method comprising the steps of:

providing a mold having a mold cavity formed therein;

locating an electrical circuit within said mold cavity, wherein said electrical circuit comprises electrical components assembled to an electrical circuit board prior to any molding operations thereof;

injection molding a plastics material into said mold cavity of said mold, wherein said plastics material covers and seals said electrical circuit to provide insulation and environmental protection to said electrical circuit.

integrating said electrical circuit with a latch mechanism, wherein said electrical circuit communicates electrically with said latch mechanism; and

configuring said mold to provide a mold form geometry that permits a plurality of components to be connected electrical to said electrical circuit and said latch mechanism after said injection molding of said plastics material into said mold cavity.

11. The method of claim 10 wherein said latch mechanism comprises a vehicle door latch of a vehicle door latch assembly.

20. The system of claim 10 wherein said latch mechanism comprises a vehicle door latch of a vehicle door latch assembly.

12. An injection molding system, comprising:

a mold having a mold cavity formed therein;

an electrical circuit comprising an electrical circuit board, which is locatable within said mold cavity;

wherein said electrical circuit board comprises electrical components assembled to said electrical circuit board prior to any molding operations thereof;

an injection molding mechanism for injection molding a plastics material into said mold cavity of said mold, wherein said plastics material covers and seals said electrical circuit to provide insulation and environmental protection to said electrical circuit.

14. The system of claim 12 wherein said mold comprises a mold form geometry that permits a plurality of components to be connected electrical to said electrical circuit and an associated latch mechanism after said injection molding of said plastics material into said mold cavity.

15. The system of claim 14 wherein said mold form geometry comprises at least one gap in which an additional component can be located.

16. The system of claim 14 wherein said mold form geometry comprises at least one mounting surface feature.

17. The system of claim 14 wherein said mold form geometry comprises at least one pivot feature.

18. The system of claim 14 wherein said mold form geometry comprises at least one flange feature.

19. The system of claim 14 wherein said mold form geometry comprises at least one seal feature.