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Inductive device including bond wires

  • US 20050122198A1
  • Filed: 12/05/2003
  • Published: 06/09/2005
  • Est. Priority Date: 12/05/2003
  • Status: Active Grant
First Claim
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1. An inductive device, comprising:

  • a core coupled to a substrate; and

    a conductive coil surrounding the core, the coil comprising segments formed from a first plurality of bond wires and a second plurality of bond wires, the first plurality of bond wires extending between the core and the substrate, each of the first plurality of bond wires coupled to two of a plurality of wire bond pads, and the second plurality of bond wires extending over the core and coupled between two of the plurality of wire bond pads.

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