Integrated circuit inductors

• US 20050122199A1
• Filed: 12/28/2004
• Published: 06/09/2005
• Est. Priority Date: 07/09/1999
• Status: Abandoned Application

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Application Number:
  US11/023,713
• Publication Number:
  US 20050122199A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate having a plurality of perforations; and

a conductive material interwoven with the substrate through the plurality of perforations for producing a magnetic field.

2. The inductor of claim 1 further comprising a layer formed over the substrate, wherein the layer is surrounded by the conductive material.

3. The inductor of claim 2 further comprising a second layer formed over the substrate, wherein the second layer is surrounded by the conductive material.

4. The inductor of claim 3, wherein the first layer includes a magnetic film.

5. The inductor of claim 4, wherein the second layer includes an insulating material.

6. The inductor of claim 3, wherein the first layer includes a magnetic oxide and the second layer includes an inorganic oxide.

7. An inductor comprising:

a substrate having a plurality of perforations and a plurality of layers; and

a conductive material interwoven with the substrate through the plurality of perforations for producing a reinforcing magnetic field in the plurality of layers.

8. The inductor of claim 7, wherein at least one layer of the plurality of layers includes a magnetic film.

9. The inductor of claim 8, wherein the magnetic film includes a magnetic oxide.

10. The inductor of claim 7, wherein at least one layer of the plurality of layers is fabricated from nickel and iron.

11. The inductor of claim 7, wherein the coil has a triangular cross-section.

12. The inductor of claim 7, wherein the coil has a rectangular cross-section.

13. An inductor comprising:

a substrate having a plurality of perforations connecting opposing substrate surfaces;

a magnetic film layer atop at least one of the opposing substrate surfaces; and

a conductive material interwoven with the substrate through the plurality of perforations for producing a reinforcing magnetic field in the magnetic film layer.

14. The inductor of claim 13, wherein the conductive material includes one of copper and gold.

15. The inductor of claim 13, wherein the substrate includes crystalline semiconductor material.

16. The inductor of claim 13, wherein the magnetic film layer includes a magnetic oxide.

17. The inductor of claim 13, wherein the magnetic film layer includes nickel and iron.

18. An inductor comprising:

a substrate having a plurality of perforations and a plurality of layers; and

a conductive material interwoven with the substrate through the plurality of perforations for forming a conductive path in a form of a coil to produce a reinforcing magnetic field in at least one of the plurality of layers, wherein the coil surrounds at least one layer of the plurality of layers.

19. The inductor of claim 18, wherein the plurality of layers includes a layer of magnetic oxide.

20. The inductor of claim 18, wherein the plurality of layers includes an insulating layer.

21. The inductor of claim 18, wherein the conductive path includes a first set of straight conductive segments connected to a plurality of straight conductive interconnects.

22. An inductor comprising:

a substrate having a first surface, a second surface, and a plurality of perforations connecting the first and second surfaces;

a magnetic film layer formed over the first surface;

an insulating layer formed over the first surface; and

a conductive material interwoven with the substrate through the plurality of perforations, wherein the coil surrounds at least one of the magnetic film layer and the insulating layer.

23. The inductor of claim 22, wherein the insulating layer is formed between the insulating layer and the first surface of the substrate.

24. The inductor of claim 22, wherein the magnetic film layer is formed between the insulating layer and the first surface of the substrate.

25. The inductor of claim 22, wherein the magnetic film includes a magnetic oxide.

26. The inductor of claim 22, wherein the insulating layer includes an inorganic oxide.

27. An inductor comprising:

a substrate having a first surface, a second surface, and a plurality of perforations connecting the first and second surfaces;

a first magnetic film layer formed over the first surface;

a second magnetic film layer formed over the second surface; and

a conductive material interwoven with the substrate through the plurality of perforations, wherein the coil surrounds the first and second magnetic film layers.

28. The inductor of claim 27, wherein one of the first and second magnetic films includes a magnetic oxide.

29. The inductor of claim 27, wherein one of the first and second the magnetic film layers includes an alloy of nickel and iron.

30. The inductor of claim 29, wherein conductive material includes copper.

31. The inductor of claim 29, wherein conductive material includes gold.

32. An inductor comprising:

a semiconductor substrate having a first side, a second side, and a plurality of perforations connecting the first and second sides;

a plurality of layers formed atop at least one of the first and second sides;

a plurality of first conductive segments formed in the perforations, the plurality of first conductive segments including a first conductive material; and

a plurality of second conductive segments connected to the plurality of first conductive segments to form a coil for producing a magnetic field, the plurality of second conductive segments including a second conductive material, wherein the coil is at least partially interwoven with the substrate.

33. The inductor of claim 32, wherein one of the first and second conductive materials includes copper.

34. The inductor of claim 32, wherein one of the first and second conductive materials includes gold.

35. The inductor of claim 32, wherein the plurality of layers includes at least one layer of magnetic material.

36. The inductor of claim 35, wherein the plurality of layers includes an insulating layer covering the layer of magnetic material.

37. A method comprising:

forming a plurality of perforations in a substrate; and

forming a conductive material interwoven with the substrate through the plurality of perforations for producing a magnetic field.

38. The method of claim 37 further comprising:

forming a layer over the substrate, wherein the layer is surrounded by the conductive material.

39. The method of claim 38 further comprising;

forming a second layer over the substrate, wherein the second layer is surrounded by the conductive material.

40. The method of claim 39, wherein the first layer includes a magnetic film.

41. The method of claim 40, wherein the second layer includes an insulating material.

42. The method of claim 39, wherein the first layer includes a magnetic oxide and the second layer includes an inorganic oxide.