Composition and method for removing photoresist materials from electronic components
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Abstract
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
10 Citations
26 Claims
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1-14. -14. (canceled)
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15. A method for pulsing fluids comprising:
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forming a treating fluid mixture under pressure;
positioning a substrate having a surface material to be treated into a processing vessel;
sending treating fluid mixture into the processing vessel;
releasing a first pulse of the fluid out of the processing vessel;
sending treating fluid mixture into the processing vessel again; and
releasing a second pulse of the fluid out of the processing vessel. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification